Browsing by author "Wang, Cong"
Now showing items 1-6 of 6
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Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young's modulus
Verdonck, Patrick; Wang, Cong; Le, Quoc Toan; Souriau, Laurent; Vanstreels, Kris; Krishtab, Mikhail; Baklanov, Mikhaïl (2014) -
Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus
Verdonck, Patrick; Wang, Cong; Souriau, Laurent; Vanstreels, Kris; Baklanov, Mikhaïl (2013) -
Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Van Besien, Els; Wang, Cong; Verdonck, Patrick; Singh, Arjun; Barbarin, Yohan; Schaekers, Marc; Baklanov, Mikhaïl; Van Elshocht, Sven (2013) -
Evaluation of barrier integrity on ultra low-k films with different porosities
Wang, Cong; Van Besien, Els; Baklanov, Mikhaïl; Verdonck, Patrick (2013) -
Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films
Godavarthi, Srinivas; Wang, Cong; Verdonck, Patrick; Matsumoto, Y.; Koudriavtsev, I; Dutt, A.; Tielens, Hilde; Baklanov, Mikhaïl (2015) -
Study of porogen removal by HWCVD for the fabrication of advanced low-k films
Godavarthi, Srinivas; Wang, Cong; Verdonck, Patrick; Matsumoto, Yasuhiro; Koudriavtsev, I; Tielens, Hilde; Baklanov, Mikhaïl (2012)