Browsing by author "Li, Hua"
Now showing items 1-10 of 10
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A new approach for the measurement of resistivity and cross-sectional area of an aluminium interconnect line: principle and applications
Li, Hua; Jin, S.; Proost, Joris; Van Hove, Marleen; Froyen, L.; Maex, Karen (1998) -
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Li, Hua; Heyvaert, Ilse; Sing, Jin; Lanckmans, Filip; Brijs, Bert; Bender, Hugo; Maex, Karen; Froyen, L. (1999) -
Characterization of WF6/N2/H2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization
Li, Hua; Jin, S.; Bender, Hugo; Lanckmans, Filip; Heyvaert, Ilse; Maex, Karen; Froyen, L. (2000) -
Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)
Li, Hua; Witvrouw, Ann; Jin, S.; Bender, Hugo; Maex, Karen; Froyen, L. (1998) -
Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
Proost, Joris; Li, Hua; Brijs, Bert; Witvrouw, Ann; Maex, Karen (1998) -
Gaseous impurities in Co silicidation - impact and solutions
Li, Hua; Vereecke, Guy; Maex, Karen; Froyen, L. (2001) -
Interaction of Ti capped Co thin film with Si3N4
Li, Hua; Bender, Hugo; Conard, Thierry; Maex, Karen; Gutakovskii, A.; Van Landuyt, J.; Froyen, L. (2000) -
Materials issues of surfaces and interfaces in IC interconnections and contacts
Li, Hua (2003-05) -
Segregation of Cu on etched and non-etched Al(Cu) surface
Li, Hua; Maex, Karen; Brijs, Bert; Conard, Thierry; Vandervorst, Wilfried; Baklanov, Mikhaïl; Boullart, Werner; Froyen, L. (1998) -
Thermal desorption issues related to silicidation and back-end metallization
Li, Hua; Vereecke, Guy; Schaekers, Marc; Baklanov, Mikhaïl; Sleeckx, Erik; Maex, Karen; Froyen, L. (2000)