Browsing by author "El-Mekki, Zaid"
Now showing items 21-37 of 37
-
High-speed TSV integration in an active silicon photonics interposer platform
Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2011) -
Impact of "terminal effect" on Cu plating: options and roadmap
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Integration of a k=2.3 spin-on polymer for the sub-28nm technology node
Wilson, Chris; Lazzarino, Frederic; Truffert, Vincent; Kirimura, Tomoyuki; de Marneffe, Jean-Francois; Verdonck, Patrick; Hirai, M.; Nakatani, K.; Tada, M.; Heylen, Nancy; El-Mekki, Zaid; Vanstreels, Kris; Van Besien, Els; Ciofi, Ivan; Stucchi, Michele; Croes, Kristof; Zhang, Liping; Demuynck, Steven; Ercken, Monique; Xu, Kaidong; Baklanov, Mikhaïl; Tokei, Zsolt (2012) -
Interconnects for scaled SRAM with vertical Surrounded Gate Transistors (SGT)
Boemmels, Juergen; Harada, N.; Kim, Min-Soo; Mitard, Jerome; Kikuchi, Yoshiaki; Li, Waikin; Tao, Zheng; Puliyalil, Harinarayanan; Devriendt, Katia; Lorant, Christophe; Le, Quoc Toan; Kesters, Els; Jourdan, Nicolas; El-Mekki, Zaid; Teugels, Lieve; van der Veen, Marleen; Li, Y.; Nakamura, H.; Mocuta, Dan; Masuoka, F. (2019) -
N5 technology node dual-damascene interconnects enabled using multi patterning
Briggs, Basoene; Wilson, Chris; Devriendt, Katia; van der Veen, Marleen; Decoster, Stefan; Paolillo, Sara; Versluijs, Janko; Kesters, Els; Sebaai, Farid; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Verdonck, Patrick; Wan, Danny; Varela Pedreira, Olalla; Croes, Kristof; Dutta, Shibesh; Ryckaert, Julien; Mallik, Arindam; Lariviere, Stephane; Boemmels, Juergen; Tokei, Zsolt (2017) -
Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations
Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Armini, Silvia; Philipsen, Harold; El-Mekki, Zaid; Redolfi, Augusto; Van Ammel, Annemie; Radisic, Alex; Nagar, Magi; Ruythooren, Wouter (2010) -
Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Armini, Silvia; Wilson, Chris; Moussa, Alain; Franquet, Alexis; Vanstreels, Kris; Atanasova, Tanya; Radisic, Alex; Civale, Yann; Redolfi, Augusto; Van Ammel, Annemie; El-Mekki, Zaid; Bryce, George; Ruythooren, Wouter (2010) -
Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020) -
"Terminal effect" on Cu electrochemical deposition: options and roadmap
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node
Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Y.S.; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2011) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011) -
Wafer scale copper direct plating on thin PVD RuTa layers: a route to enable filling 30 nm features and below?
Armini, Silvia; El-Mekki, Zaid; Nagar, Magi; Radisic, Alex; Ruythooren, Wouter; Vereecken, Philippe (2014) -
Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?
Armini, Silvia; El-Mekki, Zaid; Nagar, Margalit; Radisic, Alex; Vereecken, Philippe (2014)