Browsing by author "Brand, Sebastian"
Now showing items 1-9 of 9
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3D Localization of liner breakdown within Cu filled TSV?s by backside LIT and PEM defocusing series
Altmann, Frank; Grosse, Christian; De Wolf, Ingrid; Brand, Sebastian (2017) -
Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Brand, Sebastian; Kogel, Michael; Altmann, Frank; De Wolf, Ingrid; Khaled, Ahmad; Moore, Michael J.; Strohm, Eric M.; Kolios, Michael C.; Strohm, Eric. M. (2017) -
An alternative application of ToF-SIMS/in-situ AFM: controlled sample preparation for IC failure analysis
Franquet, Alexis; Spampinato, Valentina; Khaled, Ahmad; Conard, Thierry; Brand, Sebastian; Kogel, M; Wiesler, I; De Wolf, Ingrid (2019) -
Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatiana; Ingo, Wiesler (2018-11) -
Failure and stress analysis of Cu TSVs using
De Wolf, Ingrid; Khaled, Ahmad; Herms, Martin; Wagner, Matthias; Djuric, Tatjana; Czurratis, Peter; Brand, Sebastian (2015) -
GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
De Wolf, Ingrid; Khaled, Ahmad; Franquet, Alexis; Spampinato, Valentina; Conard, Thierry; Brand, Sebastian; Kögel, Michael; Wiesler, Ingo (2019) -
Investigating stress measurement capabilities using GHz scanning acoustic microscopy for 3D failure analysis
Khaled, Ahmad; Brand, Sebastian; Kogel, M.; Appenroth, T.; De Wolf, Ingrid (2016) -
Study of GHz-SAM sensitivity to delamination in BEOL layers
Khaled, Ahmad; Kljucar, Luka; Brand, Sebastian; Kögel, Michael; Aertgeerts, R.; Nicasy, R.; De Wolf, Ingrid (2017) -
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Koegel, Michael; Brand, Sebastian; Grosse, Christian; Jacobs, Kristof J.P.; De Wolf, Ingrid; Altmann, Frank (2021)