Browsing by author "Tabuchi, Tomotaka"
Now showing items 1-4 of 4
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A detailed study of a novel wafer separation method for surface sensitive MEMS wafers
Malachowski, Karl; Severi, Simone; Van Hoof, Rita; Sangameswaran, Sandeep; Witvrouw, Ann; Genda, Satoshi; Tabuchi, Tomotaka; Uchiyama, Naoki (2011) -
Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process
Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter (2012) -
Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)
Zhao, Ming; Verbinnen, Greet; Yoshida, Shinji; Hayakawa, Susumu; Tabuchi, Tomotaka; Jourdain, Anne; Beyne, Eric; Swinnen, Bart; Leunissen, Peter (2010) -
Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch
Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter (2012)