Browsing by author "Ashraf, Huma"
Now showing items 1-10 of 10
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Characterization of optical end-point detection for via reveal processing
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Ashraf, Huma; Thomas, Dave (2018) -
Comparison between wet and dry silicon via reveal in 3D backside processing
Thomas, Dave; Hopkins, Janet; Ashraf, Huma; Patel, Jash; Ansell, Oliver; Jourdain, Anne; De Vos, Joeri; Miller, Andy; Beyne, Eric (2015) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Etch process modules development and integration in 3D SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele; Walsby, Edward; Ansell, Oliver; Ashraf, Huma; Thomas, Dave (2017) -
Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018) -
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne; Schleicher, Filip; De Vos, Joeri; Stucchi, Michele; Chery, Emmanuel; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Walsby, Edward; Roberts, Kerry; Ashraf, Huma; Thomas, Dave; Beyne, Eric (2020) -
Extreme wafer thinning optimization for via-last applications
Jourdain, Anne; De Vos, Joeri; Inoue, Fumihiro; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Hopkins, Janet; Ashraf, Huma; Thomas, Dave (2016) -
Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
De Vos, Joeri; Stucchi, Michele; Jourdain, Anne; Beyne, Eric; Patel, Jash; Crook, Kath; Carruthers, Mark; Hopkins, Janet; Ashraf, Huma (2015) -
Microfluidics on 200mm quartz substrate using semiconductor fab dry etch process as an enabler for imaging applications in life sciences
Stassen, Andim; Fiorentino, Giuseppe; Jones, Ben; Stahl, Richard; Dupont, Tania; Vrancken, Evi; Humbert, Aurelie; Severi, Simone; Wood, Alex; Worster, Will; Riddell, Kevin; Ashraf, Huma; Thomas, Dave (2017) -
Silicon microfluidics: an enabling technology for life sciences application
Majeed, Bivragh; Zhang, Lei; Fiorentino, Giuseppe; Verbinnen, Greet; Ashraf, Huma; Walsby, Edward; Roberts, Kerry; Al Kuzee, Jafar; Dawe, Rhys; Thomas, Dave; Sabuncuoglu Tezcan, Deniz (2017)