Browsing by author "Okoro, Chukwudi"
Now showing items 1-20 of 21
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Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
Okoro, Chukwudi; Eneman, Geert; Gonzalez, Mario; Vandevelde, Bart; Swinnen, Bart; Stoukatch, Serguei; Beyne, Eric; Vandepitte, Dirk (2007-05) -
Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Okoro, Chukwudi; Jourdain, Anne; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk (2008) -
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Mercha, Abdelkarim; Van der Plas, Geert; Moroz, V.; De Wolf, Ingrid; Asimakopoulos, Panagiotis; Minas, Nikolaos; Domae, Shinichi; Perry, Dan; Choi, M.; Redolfi, Augusto; Okoro, Chukwudi; Yang, Yu; Van Olmen, Jan; Thangaraju, Sarasvathi; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Cho, Jong Hoon; Yakovlev, A.; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Elimination of the axial deformation problem of Cu-TSV in 3D integration
Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2010) -
Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C.; Christiaens, W.; Vanfleteren, Jan (2007) -
Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Huyghebaert, Cedric; Van Olmen, Jan; Okoro, Chukwudi; Coenen, Jens; Jourdain, Anne; Van Cauwenberghe, Marc; Agarwal, Rahul; Phommahaxay, Alain; Stucchi, Michele; Soussan, Philippe (2010) -
Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
Duval, Fabrice; Soussan, Philippe; Miller, Andy; De Raedt, Walter; Sun, Xiao; Beyne, Eric; Okoro, Chukwudi (2010) -
Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy
Okoro, Chukwudi; Yang, Yu; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk; Verlinden, Bert; De Wolf, Ingrid (2008) -
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2011) -
Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Okoro, Chukwudi; Vanstreels, Kris; Labie, Riet; Luhn, Ole; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2010) -
Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Okoro, Chukwudi; Agarwal, Rahul; Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Beyne, Eric (2010) -
Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias
Vanstreels, Kris; Okoro, Chukwudi; Labie, Riet (2010) -
Novel Cu-Cu bonding technique: the insertion bonding approach
Okoro, Chukwudi; Limaye, Paresh; Agarwal, Rahul; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2011) -
Polymer filling of silicon trenches for 3D through silicon vias applications
Duval, Fabrice; Okoro, Chukwudi; Civale, Yann; Soussan, Philippe; Beyne, Eric (2011) -
Prediction of the influence of induced stresses in silicon on CMOS Performance in a Cu-through-via interconnect technology
Okoro, Chukwudi; Gonzalez, Mario; Vandevelde, Bart; Swinnen, Bart; Eneman, Geert; Verheyen, Peter; Beyne, Eric; Vandepitte, Dirk (2007-04) -
Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
Minas, Nikolaos; Van der Plas, Geert; Oprins, Herman; Yang, Yu; Okoro, Chukwudi; Mercha, Abdelkarim; Torregiani, Cristina; Perry, Dan; Marchal, Pol; Rakowski, Michal; Cherman, Vladimir (2010) -
Thermal and mechanical aspects for flexible embedded components
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C. (2007) -
Thermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking
Okoro, Chukwudi (2010-12)