Browsing by author "Nolmans, Philip"
Now showing items 21-29 of 29
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Minimizing interposer warpage by process control and design optimization
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; De Messemaeker, Joke; Gonzalez, Mario; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2014) -
Nanotopography control for wafer-to-wafer hybrid bonding by CMP
Heylen, Nancy; Kim, Soon-Wook; Kim, Tae-Gon; Peng, Lan; Nolmans, Philip; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Sofie (2017) -
New insights into charging in capacitive RF MEMS switches
Czarnecki, Piotr; Rottenberg, Xavier; Soussan, Philippe; Nolmans, Philip; Ekkels, Phillip; Muller, Philippe; Tilmans, Harrie; De Raedt, Walter; Puers, Bob; Marchand, Laurent; De Wolf, Ingrid (2008) -
RF-MEMS technology, components and circuits
Rottenberg, Xavier; Ekkels, Phillip; Brebels, Steven; Czarnecki, Piotr; Nauwelaers, Bart; Soussan, Philippe; Nolmans, Philip; Marchand, Laurent; Guijarro, Juan; De Wolf, Ingrid; Tilmans, Harrie; De Raedt, Walter (2007-10) -
Stress and bowing engineering in passive silicon interposer
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2015) -
Texture control for Cu hybrid bonding pads using a PVD Cu process
De Messemaeker, Joke; Jourdan, Nicolas; Nolmans, Philip; Kim, Soon-Wook; Beyer, Gerald (2019) -
Through-silicon via technology for three-dimensional integrated circuit manufacturing
Civale, Yann; Redolfi, Augusto; Jaenen, Patrick; Kostermans, Maarten; Van Besien, Els; Mertens, Sofie; Witters, Thomas; Jourdan, Nicolas; Armini, Silvia; Vandersmissen, Kevin; Philipsen, Harold; Verdonck, Patrick; Heylen, Nancy; Nolmans, Philip; Li, Yunlong; Croes, Kristof; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O
Guermandi, Davide; Bogaerts, Lieve; Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Bex, Pieter; De Coster, Jeroen; He, Junwen; Phommahaxay, Alain; Balakrishnan, Sadhishkumar; Demeurisse, Caroline; Bertheau, Julien; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Srinivasan, Ashwyn; Van Huylenbroeck, Stefaan; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2019) -
Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process
Kim, Soon-Wook; Detalle, Mikael; Peng, Lan; Nolmans, Philip; Heylen, Nancy; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016)