Browsing by author "La Manna, Antonio"
Now showing items 21-40 of 63
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ESD protection design in active interposer for 2.5 and 3D systems-in-package
Scholz, Mirko; Hellings, Geert; Chen, Shih-Hung; Linten, Dimitri; Detalle, Mikael; Roda Neve, Cesar; Shibkov, Andrei; La Manna, Antonio; Van der Plas, Geert; Beyne, Eric (2015-09) -
ESD protection design in smart interposer
Scholz, Mirko; Hellings, Geert; Linten, Dimitri; Detalle, Mikael; La Manna, Antonio; Van der Plas, Geert; Beyne, Eric (2015-05) -
Fat damascene wires for high bandwidth routing in silicon interposer
Detalle, Mikael; Kim, Jaemin; Nolmans, Philip; Sun, Xiao; Ryckaert, Julien; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization
Zhang, Wenqi; La Manna, Antonio; Soussan, Philippe; Beyne, Eric (2012) -
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
High density 20μm pitch CuSn microbump process for high-end 3D applications
De Vos, Joeri; Jourdain, Anne; Erismis, Mehmet Akif; Zhang, Wenqi; De Munck, Koen; La Manna, Antonio; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2011) -
High strength, polymer microneedles for transdermal drug delivery
Paul Chaudhuri, Buddhadev; Ceyssens, Frederik; Guan, Tiannan; La Manna, Antonio; Pereira Neves, Hercules; Van Hoof, Chris; Puers, Bob (2011) -
Il packaging dei dispositivi GaN-on-Si
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-01) -
In-tier diagnosis of power domains in 3D TSV ICs
Araga, Yuuki; Nagata, Makoto; Van der Plas, Geert; Kim, Jaemin; Minas, Nikolaos; Marchal, Pol; Travaly, Youssef; Libois, Michael; La Manna, Antonio; Zhang, Wenqi; Beyne, Eric (2012) -
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Buisson, Thibault; Potoms, Goedele; Phommahaxay, Alain; Verbinnen, Greet; Jaenen, Patrick; La Manna, Antonio; Travaly, Youssef; Beyne, Eric (2011) -
Integration of a 3D microwave module
Sun, Xiao; Soussan, Philippe; La Manna, Antonio; Majeed, Bivragh; De Raedt, Walter (2010) -
Interposer technology for high band width interconnect applications
Detalle, Mikael; La Manna, Antonio; De Vos, Joeri; Nolmans, Philip; Daily, Robert; Beyer, Gerald; Beyne, Eric (2013) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits
Araga, Yuuki; Nagata, Makoto; Van der Plas, Geert; Marchal, Pol; Libois, Michael; La Manna, Antonio; Zhang, Wenqi; Beyer, Gerald; Beyne, Eric (2014-06) -
Mechanical characterization of micro-bump for aggressive bump scaling
Zhang, Wenqi; Mai, Zhide; Bogaerts, Lieve; Gonzalez, Mario; Vakanas, George; La Manna, Antonio; Beyne, Eric (2012) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Minimizing interposer warpage by process control and design optimization
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; De Messemaeker, Joke; Gonzalez, Mario; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2014) -
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Zhang, Wenqi; Dimcic, Biljana; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe; Beyne, Eric (2011) -
Out-of-plane, high strength, polymer microneedles for transdermal drug delivery
Paul Chaudhuri, Buddhadev; Ceyssens, Frederik; Pereira Neves, Hercules; La Manna, Antonio; Van Hoof, Chris; Puers, Bob (2011)