Browsing by author "La Manna, Antonio"
Now showing items 41-60 of 63
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Packaging von GaN-on-Si
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-09) -
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014) -
Process development to enable die sorting and 3D IC stacking
La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12) -
Process developments for 3D-IC integration
La Manna, Antonio (2014) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12) -
Processing active devices on Si interposer and impact on cost
Velenis, Dimitrios; Detalle, Mikael; Hellings, Geert; Scholz, Mirko; Marinissen, Erik Jan; Van der Plas, Geert; La Manna, Antonio; Miller, Andy; Linten, Dimitri; Beyne, Eric (2015) -
Small pitch micro-bumping and experimental investigation for under filling 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; De Vos, Joeri; Bogaerts, Lieve; Gerets, Carine; Beyne, Eric (2012-09) -
Stacking aspects in the view of scaling
De Vos, Joeri; La Manna, Antonio; Daily, Robert; Rebibis, Kenneth June; Beyne, Eric (2012) -
Stress and bowing engineering in passive silicon interposer
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2015) -
Study of 3D process impact on advanced CMOS devices
La Manna, Antonio; Guo, Wei; Van Huylenbroeck, Stefaan; Sirignano, Emilio; Cherman, Vladimir; Van der Plas, Geert; De Wachter, Bart; Phommahaxay, Alain; Jourdain, Anne; Beyer, Gerald; Beyne, Eric (2013) -
Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
The road towards fully hybrid CMOS imager sensors
De Vos, Joeri; Jourdain, Anne; Zhang, Wenqi; De Munck, Koen; De Moor, Piet; La Manna, Antonio (2011) -
Thermo mechanical challenges for processing and packaging stacked ultrathin wafers
Gonzalez, Mario; Vandevelde, Bart; La Manna, Antonio; Swinnen, Bart; Beyne, Eric (2013) -
Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits
Ivankovic, Andrej; Cherman, Vladimir; Vandevelde, Bart; Van der Plas, Geert; Rebibis, Kenneth June; La Manna, Antonio; Beyne, Eric; De Wolf, Ingrid; Vandepitte, Dirk (2011) -
Transient analysis based thermal characterization of die-die interfaces in 3D-ICs
Oprins, Herman; Cherman, Vladimir; Rebibis, Kenneth June; Vermeersch, Kristina; Gerets, Carine; Vandevelde, Bart; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012-05) -
Underfill material screening and process characterization for 3D stacking
Rebibis, Kenneth June; La Manna, Antonio; Gerets, Carine; Beyne, Eric; Daily, Robert; Capuz, Giovanni (2012) -
Use of Wafer Applied Under Fill for 3D Stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2011) -
Use of wafer applied underfill for 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2012) -
Using wafer leve underfill for 3D packaging
Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric; La Manna, Antonio (2011) -
Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013)