Browsing by author "Van Aelst, Joke"
Now showing items 21-28 of 28
-
Plasma ash modulation of TDDB thermal activation energy in damascene SiOC:H
Li, Yunlong; Tokei, Zsolt; Van Aelst, Joke; Carbonell, Laure; Baklanov, Mikhaïl; Richard, Olivier; Bender, Hugo; Groeseneken, Guido; Maex, Karen (2007) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson Highlands chamber
Mannaert, Geert; Van Cauwenberghe, M.; Schmidt, Michael; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2002) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson HighlandsTM chamber
Mannaert, Geert; Van Cauwenberghe, Marc; Schmidt, M.O.; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2003) -
Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect
Tokei, Zsolt; Van Aelst, Joke; Waldfried, C.; Escorcia, O.; Roussel, Philippe; Richard, Olivier; Travaly, Youssef; Beyer, Gerald; Maex, Karen (2005) -
Single damascene integration of porous zirkonTM version 1 low-k dielectric films
Malhouitre, Stéphane; Jehoul, Christiane; Van Aelst, Joke; Struyf, Herbert; Brongersma, Sywert; Carbonell, Laure; Vos, Ingrid; Beyer, Gerald; Van Hove, Marleen; Gronbeck, D.; Gallagher, M.; Calvert, J.; Maex, Karen (2003-11) -
Studies on XLK film characterization and integration in copper damascene processes
Iacopi, Francesca; Alves Donaton, Ricardo; Coenegrachts, Bart; Komiya, Takayuki; Struyf, Herbert; Lepage, Muriel; Van Aelst, Joke; Boullart, Werner; De Roest, David; Vos, Ingrid; Baklanov, Mikhaïl; Vereecke, Guy; Van Hove, Marleen; Stucchi, Michele; Tokei, Zsolt; Meynen, Herman; Bremmer, J. N.; Vanhaelemeersch, Serge; Maex, Karen (2001) -
Wafer bevel protection during deep reactive ion etching
Charavel, Remy; Gassot, Pierre; de Backer, E.; Altamirano Sanchez, Efrain; Van Aelst, Joke; Devriendt, Katia; Van Wichelen, Koen (2010) -
Wafer bevel protection during deep reactive ion etching
Charavel, Remy; Roig, Jaime; Altamirano Sanchez, Efrain; Van Aelst, Joke; Devriendt, Katia; Van Wichelen, Koen; Gassot, Pierre; Coppens, Peter; De Backer, Eddy (2011)