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Dry Etch Challenges for Patterning Middle-of-line (MOL) Contact Trench in Monolithic CFET (complementary FET)

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0001-7961-9727
cris.virtual.orcid0000-0001-5490-0416
cris.virtual.orcid0009-0006-4655-5417
cris.virtual.orcid0000-0001-9966-0399
cris.virtual.orcid0000-0001-7429-7570
cris.virtual.orcid0000-0002-4320-0585
cris.virtualsource.departmentd70ee97b-1cd7-4648-9ef2-ac106b21dfb5
cris.virtualsource.department9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.department06210970-9201-4c2c-b588-e59e60ef24ae
cris.virtualsource.department9f5db133-d1cf-4622-ac24-d1735c7157a9
cris.virtualsource.department07aba315-d17f-44ec-a8a8-d4fedf1a8b96
cris.virtualsource.departmentee5d621b-1e10-4b32-9e9c-8ab5798e42a6
cris.virtualsource.orcidd70ee97b-1cd7-4648-9ef2-ac106b21dfb5
cris.virtualsource.orcid9f04b13f-f81c-4d48-a5bd-0b2cb5210392
cris.virtualsource.orcid06210970-9201-4c2c-b588-e59e60ef24ae
cris.virtualsource.orcid9f5db133-d1cf-4622-ac24-d1735c7157a9
cris.virtualsource.orcid07aba315-d17f-44ec-a8a8-d4fedf1a8b96
cris.virtualsource.orcidee5d621b-1e10-4b32-9e9c-8ab5798e42a6
dc.contributor.authorSarkar, T.
dc.contributor.authorRadisic, Dunja
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorStiers, Karen
dc.contributor.authorSheng, C.
dc.contributor.authorMontero Alvarez, Daniel
dc.contributor.authorJenkins, H.
dc.contributor.authorDemand, M.
dc.contributor.authorWang, P.
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorHoriguchi, Naoto
dc.contributor.imecauthorSarkar, T.
dc.contributor.imecauthorRadisic, D.
dc.contributor.imecauthorGonzalez, V. Vega
dc.contributor.imecauthorStiers, K.
dc.contributor.imecauthorSheng, C.
dc.contributor.imecauthorMontero, D.
dc.contributor.imecauthorLazzarino, F.
dc.contributor.imecauthorHoriguchi, N.
dc.date.accessioned2024-06-06T18:30:28Z
dc.date.available2024-06-06T18:30:28Z
dc.date.issued2024
dc.identifier.doi10.1117/12.3014213
dc.identifier.eisbn978-1-5106-7223-9
dc.identifier.isbn978-1-5106-7222-2
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43997
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage129590B
dc.source.conferenceConference on Advanced Etch Technology and Process Integration for Nanopatterning XIII
dc.source.conferencedate2024-02-25
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.numberofpages9
dc.title

Dry Etch Challenges for Patterning Middle-of-line (MOL) Contact Trench in Monolithic CFET (complementary FET)

dc.typeProceedings paper
dspace.entity.typePublication
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