Publication:

Barrier/liner stacks for scaling the Cu interconnect metallization

Date

2016

Proceedings Paper

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Files

33683.pdf 2.29 MB

Author(s)

van der Veen, Marleen

;

Jourdan, Nicolas

;

Vega Gonzalez, Victor

;

;

;

Varela Pedreira, Olalla

;

Struyf, Herbert

;

;

Boemmels, Juergen

;

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Acq. date: 2026-05-15