Publication:

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Date

2023
Journal article
https://doi.org/10.1109/TCPMT.2023.3264520
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Accepted version 15.52 MB
Published version 3.32 MB

Author(s)

Agnesina, Anthony
;
Brunion, Moritz
;
Kim, Jinwoo
;
Garcia-Ortiz, Alberto
;
Milojevic, Dragomir  
;
Catthoor, Francky  
;
Mirabelli, Gioele  
;
Komalan, Manu
;
Lim, Sung Kyu

Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

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880 since deposited on 2023-06-24
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1139 since deposited on 2023-06-24
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