Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Agnesina, Anthony; Brunion, Moritz; Kim, Jinwoo; Garcia-Ortiz, Alberto; Milojevic, Dragomir; Catthoor, Francky; Mirabelli, Gioele; Komalan, Manu; Lim, Sung Kyu

doi:10.1109/TCPMT.2023.3264520

Publication:

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Date

2023

Journal article

https://doi.org/10.1109/TCPMT.2023.3264520

Simple item page Full metadata Statistics

Files

Accepted version 15.52 MB

Published version 3.32 MB

Author(s)

Agnesina, Anthony

;

Brunion, Moritz

;

Kim, Jinwoo

;

Garcia-Ortiz, Alberto

;

;

;

;

;

Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Metrics

862 since deposited on 2023-06-24

5last month

2last week

Acq. date: 2025-12-18

1139 since deposited on 2023-06-24

Acq. date: 2025-12-18

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Date

Files

Author(s)

Journal

Abstract

Description

Metrics

Downloads

Views

Citations

Metrics

Downloads

Views

Citations