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Chemical mechanical polishing for indium bond pad damascene processing
Publication:
Chemical mechanical polishing for indium bond pad damascene processing
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Date
2024
Journal article
https://doi.org/10.35848/1347-4065/ad2135
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3.45 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ceulemans, Karl
;
Shafahian, Ehsan
;
Struyf, Herbert
;
Devriendt, Katia
;
Deckers, Steven
;
Heylen, Nancy
;
Derakhshandeh, Jaber
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
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713
since deposited on 2024-03-02
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Metrics
Downloads
175
since deposited on 2024-03-02
11
last month
5
last week
Acq. date: 2026-01-12
Views
713
since deposited on 2024-03-02
1
last month
1
last week
Acq. date: 2026-01-12
Citations