Publication:

Chemical mechanical polishing for indium bond pad damascene processing

Date

2024
Journal article
https://doi.org/10.35848/1347-4065/ad2135
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dc.contributor.authorCeulemans, Karl
dc.contributor.authorShafahian, Ehsan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorDevriendt, Katia
dc.contributor.authorDeckers, Steven
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.imecauthorCeulemans, Karl
dc.contributor.imecauthorShafahian, Ehsan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorDeckers, Steven
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.orcidimecCeulemans, Karl::0000-0002-6941-4207
dc.contributor.orcidimecShafahian, Ehsan::0000-0001-6125-5793
dc.contributor.orcidimecStruyf, Herbert::0000-0002-6782-5424
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecDeckers, Steven::0000-0003-3389-0348
dc.contributor.orcidimecHeylen, Nancy::0009-0008-0490-0993
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.date.accessioned2024-09-16T12:33:33Z
dc.date.available2024-03-02T17:43:15Z
dc.date.available2024-09-16T12:33:33Z
dc.date.embargo2024-02-19
dc.date.issued2024
dc.description.wosFundingTextSincere thanks for their continuous support and aid to this work go out to the Fab Operations, First line support, Engineering support, Hardware engineering, 3D Integration, Quantum Computing program, Plating R&D, and CMP R&D teams at imec. This work was supported by the MATQU project, which is funded through the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. Please visit https://www.matqu.eu!
dc.identifier.doi10.35848/1347-4065/ad2135
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43617
dc.publisherIOP Publishing Ltd
dc.source.beginpageArt. 03SP39
dc.source.endpageN/A
dc.source.issue3
dc.source.journalJAPANESE JOURNAL OF APPLIED PHYSICS
dc.source.numberofpages17
dc.source.volume63
dc.subject.keywordsMODEL
dc.subject.keywordsPLANARIZATION
dc.title

Chemical mechanical polishing for indium bond pad damascene processing

dc.typeJournal article
dspace.entity.typePublication
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