Publication:

Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies

Date

2023
Journal article
https://doi.org/10.1109/TMTT.2023.3244205
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dc.contributor.authorBosman, Dries
dc.contributor.authorHuynen, Martijn
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorSun, Xiao
dc.contributor.authorPantano, Nicolas
dc.contributor.authorVan Der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorGinste, Dries Vande
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorVan Der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-07-24T09:54:04Z
dc.date.available2023-03-18T03:37:51Z
dc.date.available2023-07-24T09:54:04Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.identifier.doi10.1109/TMTT.2023.3244205
dc.identifier.issn0018-9480
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41303
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage2794
dc.source.endpage2806
dc.source.issue7
dc.source.journalIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
dc.source.numberofpages13
dc.source.volume71
dc.subject.keywordsTRANSMISSION-LINE PARAMETERS
dc.subject.keywordsINTEGRAL-EQUATION
dc.subject.keywordsLOSSY CONDUCTORS
dc.subject.keywordsSERIES IMPEDANCE
dc.subject.keywordsSKIN
dc.title

Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies

dc.typeJournal article
dspace.entity.typePublication
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