Publication:
Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements
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2015 since deposited on 2021-10-23
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Acq. date: 2026-03-01
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2015 since deposited on 2021-10-23
2last month
1last week
Acq. date: 2026-03-01
Citations