Publication:

Al3Sc thin films for advanced interconnect applications

Date

2024

Journal article

https://doi.org/10.1016/j.mee.2024.112141

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Files

Published version 4.57 MB

Accepted version 1.25 MB

Author(s)

Soulie, Jean-Philippe

;

Sankaran, Kiroubanand

;

Founta, Valeria

;

;

Detavernier, Christophe

;

Van de Vondel, Joris

;

Pourtois, Geoffrey

;

;

;

Adelmann, Christoph

Journal

MICROELECTRONIC ENGINEERING

Metrics

640 since deposited on 2024-03-29

11last month

4last week

Acq. date: 2026-01-09