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Conference contributions
Integration of electroless and electrolytic Cu in the IC back end line of technologies
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Integration of electroless and electrolytic Cu in the IC back end line of technologies
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Date
1999
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3613.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maex, Karen
;
Palmans, Roger
;
Lantasov, Yuri
;
Brongersma, Sywert
;
Richard, Emmanuel
;
Vervoort, Iwan
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1951
since deposited on 2021-10-14
Acq. date: 2025-12-09
Citations
Metrics
Views
1951
since deposited on 2021-10-14
Acq. date: 2025-12-09
Citations