Publication:

Evolution of lithography-to-etch bias in multi-patterning processes

Date

2022
Journal article
https://doi.org/10.1116/6.0002059
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dc.contributor.authorPanneerchelvam, Prem
dc.contributor.authorAgarwal, Ankur
dc.contributor.authorHuard, Chad M. M.
dc.contributor.authorPret, Alessandro Vaglio
dc.contributor.authorMani, Antonio
dc.contributor.authorGronheid, Roel
dc.contributor.authorDemand, Marc
dc.contributor.authorKumar, Kaushik
dc.contributor.authorPaolillo, Sara
dc.contributor.authorLazzarino, Frederic
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecPaolillo, Sara::0000-0003-2798-5228
dc.date.accessioned2022-11-10T15:28:44Z
dc.date.available2022-10-09T02:50:47Z
dc.date.available2022-11-10T15:28:44Z
dc.date.embargo2023-12-31
dc.date.issued2022
dc.identifier.doi10.1116/6.0002059
dc.identifier.issn2166-2746
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40543
dc.publisherA V S AMER INST PHYSICS
dc.source.beginpage062601
dc.source.endpagena
dc.source.issue6
dc.source.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
dc.source.numberofpages14
dc.source.volume40
dc.subject.keywordsSILICON DIOXIDE
dc.subject.keywordsPLASMA
dc.subject.keywordsMECHANISM
dc.subject.keywordsSIO2
dc.title

Evolution of lithography-to-etch bias in multi-patterning processes

dc.typeJournal article
dspace.entity.typePublication
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