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Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Publication:
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
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Date
2022
Journal article
https://doi.org/10.35848/1347-4065/ac52ba
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Park, Kimoon
;
Inoue, Fumihiro
;
Derakhshandeh, Jaber
;
Yoo, Bongyoung
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
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1550
since deposited on 2022-03-30
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Acq. date: 2025-12-15
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Downloads
399
since deposited on 2022-03-30
49
last month
5
last week
Acq. date: 2025-12-15
Views
1550
since deposited on 2022-03-30
6
last month
Acq. date: 2025-12-15
Citations