Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Publication:
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Copy permalink
Date
2022
Journal article
https://doi.org/10.35848/1347-4065/ac52ba
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
Published version
1.7 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Park, Kimoon
;
Inoue, Fumihiro
;
Derakhshandeh, Jaber
;
Yoo, Bongyoung
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Abstract
Description
Statistics
Downloads
473
since deposited on 2022-03-30
5
last month
Acq. date: 2026-05-02
Views
1555
since deposited on 2022-03-30
3
last month
Acq. date: 2026-05-02
Citations
Statistics
Downloads
473
since deposited on 2022-03-30
5
last month
Acq. date: 2026-05-02
Views
1555
since deposited on 2022-03-30
3
last month
Acq. date: 2026-05-02
Citations