Publication:

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

Date

2022
Journal article
https://doi.org/10.35848/1347-4065/ac52ba
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dc.contributor.authorPark, Kimoon
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorYoo, Bongyoung
dc.contributor.imecauthorPark, Kimoon
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.date.accessioned2022-08-26T10:27:12Z
dc.date.available2022-03-30T02:07:17Z
dc.date.available2022-06-09T14:13:30Z
dc.date.available2022-08-26T10:27:12Z
dc.date.issued2022
dc.description.wosFundingTextThis research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0008745) supervised by the Korea Institute for Advancement of Technology (KIAT).
dc.identifier.doi10.35848/1347-4065/ac52ba
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39550
dc.publisherIOP Publishing Ltd
dc.source.beginpage041003
dc.source.issue4
dc.source.journalJAPANESE JOURNAL OF APPLIED PHYSICS
dc.source.numberofpages9
dc.source.volume61
dc.title

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

dc.typeJournal article
dspace.entity.typePublication
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