Browsing imec Publications by imec author "fd6378929c38271422c82371ee20dd6fa980f935"
Now showing items 1-13 of 13
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3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017) -
Defect identification in bonding surface layer by positron annihilation spectroscopy
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Nagano, Fuya; Sleeckx, Erik; Beyer, Gerald; Uedono, Akira; Beyne, Eric (2019) -
Direct Bonding Using Low Temperature SiCN Dielectrics
Iacovo, Serena; Nagano, Fuya; Channam, Venkat Sunil Kumar; Walsby, Edward; Crook, Kath; Buchanan, Keith; Jourdain, Anne; Vanstreels, Kris; Phommahaxay, Alain; Beyne, Eric (2022) -
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2020) -
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Nagano, Fuya; Kajihara, Masanori; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Beyer, Gerald (2017) -
Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
Onishi, Koki; Iwata, Tomoya; Habuka, Hitoshi; Nagano, Fuya; Inoue, Fumihiro (2022) -
Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Nagano, Fuya; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Kajihara, Masanori; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
Nagano, Fuya; Inoue, F.; Phommahaxay, Alain; Peng, Lan; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Uedono, A.; Beyne, Eric; De Gendt, Stefan; Iacovo, Serena (2023) -
The unique properties of SiCN as bonding material for hybrid bonding
Iacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric (2021) -
Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2022)