Browsing imec Publications by title

Low-impedance Contact CDM – Evaluation and Modeling

Simicic, Marko; Wu, Wei-Min; Chen, Shih-Hung; Jack, Nathan; Tamura, Shinichi; Shimada, Yohei; Sawada, Masanori; Linten, Dimitri (2019)

Low-k a-SiCO:H films as diffusion barriers for advanced interconnects

Van Besien, Els; Singh, Arjun; Barbarin, Yohan; Verdonck, Patrick; Dekkers, Harold; Vanstreels, Kris; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Van Elshocht, Sven (2014)

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)

Chanson, Romain; Lefaucheux, P.L.; Dussart, R.; Tillocher, T.; Shen, P.; Urabe, K.; Dussarat, C.; Maekawa, K.; Yatsuda, K.; Tahara, S.; de Marneffe, Jean-Francois (2017)

Low-k dielectric materials

Shamiryan, Denis; Abell, Thomas; Iacopi, Francesca; Maex, Karen (2004)

Low-k dielectric reliability in copper interconnects

Li, Yunlong (2007-09)

Low-k dielectric reliability: impact of test structure choice, copper and integrated dielectric quality

Tokei, Zsolt; Li, Yunlong; Ciofi, Ivan; Croes, Kristof; Beyer, Gerald (2008)

Low-k dielectrics: spin-on or CVD?

Van Bavel, Mieke; Iacopi, Francesca; Baklanov, Mikhaïl; Maex, Karen (2004)

Low-k films for 22 nm technology node and beyond

Baklanov, Mikhaïl; Zhao, Larry (2011)

Low-k films and dielectric barriers for 22 nm technology node and beyond

Baklanov, Mikhaïl (2011)

Low-k films modification under EUV and VUV radiation

Rakhimova, T.; Rakhimov, A.; Mankelevich, Y.A.; Lopaev, D.V.; Kovalev, A.S.; Vasil'eva, A.N.; Zyryanov, S.M.; Kurchikov, K.; Proshina, O.; Voloshin, D.G.; Novikova, N.N.; Krishtab, Mikhail; Baklanov, Mikhaïl (2014)

Low-k integration: Gas screening for cryogenic etching and damage mitigation

Chanson, Romain; Dussart, Remi; Tillocher, Thomas; Lefaucheux, Philippe; Dussarrat, Christian; de Marneffe, Jean-Francois (2019)

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Chanson, Romain; Tillocher, Thomas; Lefaucheux, Philippe; Dussart, Remi; Zhang, Liping; de Marneffe, Jean-Francois; Shen, P; Dussarrat, Chrsitian; Maekawa, Kaoru; yatsuda, koichi; Tahara, Shigeru (2018)

Low-k materials engineering from 10 nm technology node and beyond

Krishtab, Mikhail (2022)

Low-k materials etch and strip optimization for sub 0.25µm technology

Gao, Teng; Gray, William; Van Hove, Marleen; Rosseel, Erik; Struyf, Herbert; Meynen, Herman; Vanhaelemeersch, Serge; Maex, Karen (1999)

Low-k organic spin-on materials in a non-etchback interconnect strategy

Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Grillaert, Joost; Van den hove, Luc (1996)

Low-k OSG damage and etching by F atoms at lowered temperatures

Zyryanov, S.; Kurchikov, D.; Lopaev, D.; Mankelevich, Y.; Palov, A.; Rakhimova, T.; Voronina, E.; Novikova, N.; Baklanov, Mikhaïl (2015)

Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach

Zotovich, Alexey; Rezvanov, Askar; Chanson, Romain; Zhang, L.; Hacker, N.; Kurchikov, K.; Klimin, S.; Zyryanov, S. M.; Lopaev, Dimitri; Gornev, E.; Clemente, I.; Miakonkikh, A.; Maslakov, K. (2018)

Low-k reliability

Tokei, Zsolt (2008)

Low-k1 imaging for contacts and lines using immersion ArF

Van Bavel, Mieke; Hendrickx, Eric; Wiaux, Vincent; Vandenberghe, Geert (2005-02)

Low-latency Classification of Social Haptic Gestures Using Transformers

Ren, Qiaoqiao; Hou, Yuanbo; Belpaeme, Tony (2023)