Recently added

7.6% CZGSe solar cells thanks to optimized CdS chemical bath depostion

Choubrac, Leo; Brammertz, Guy; Barreau, Nicolas; Arzel, Ludovic; Harel, Sylvie; Meuris, Marc; Vermang, Bart (2018)

Agile management and interoperability testing of SDN/NFV-Enriched 5G core networks

Choi, T.; Kim, T.; Tavernier, Wouter; Korvala, A.; Pajunpaa, J. (2018-02)

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells

Cho, Jinyoun; Recaman Payo, Maria; Debucquoy, Maarten; Sivaramakrishnan Radhakrishnan, Hariharsudan; Gordon, Ivan; Szlufcik, Jozef; Ghannam, Moustafa; Poortmans, Jef (2018)

Passivating electron selective contacts for silicon solar cells based on an a-Si:H / TiOx stack and a low work function metal

Cho, Jinyoun; Melskens, Jimmy; Debucquoy, Maarten; Recaman Payo, Maria; Jambaldinni, Shruti; Bearda, Twan; Gordon, Ivan; Szlufcik, Jozef; Kessels, W. M. M.; Poortmans, Jef (2018)

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts

Cho, Jinyoun; Debucquoy, Maarten; Recaman Payo, Maria; Schapmans, Elie; Gordon, Ivan; Szlufcik, Jozef; Poortmans, Jef (2018)

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide

Chiha, Asma; Van Der Wee, Marlies; Verbrugge, Sofie; Colle, Didier (2018)

Layer-controlled epitaxy of 2D semiconductors: bridging nanoscale phenomena to wafer-scale uniformity

Chiappe, Daniele; Ludwig, Jonathan; Leonhardt, Alessandra; El Kazzi, Salim; Nalin Mehta, Ankit; Nuytten, Thomas; Celano, Umberto; Sutar, Surajit; Pourtois, Geoffrey; Caymax, Matty; Paredis, Kristof; Vandervorst, Wilfried; Lin, Dennis; De Gendt, Stefan; Barla, Kathy; Huyghebaert, Cedric; Asselberghs, Inge; Radu, Iuliana (2018)

Scalable, layer-controlled synthesis of 2D semiconductors

Chiappe, Daniele; El Kazzi, Salim; Afanasiev, Valeri; Leonhardt, Alessandra; Ludwig, Jonathan; Celano, Umberto; Brems, Steven; Pourtois, Geoffrey; Caymax, Matty; Schram, Tom; Huyghebaert, Cedric; Asselberghs, Inge; De Gendt, Stefan; Radu, Iuliana (2018)

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

Chiappe, Daniele; Afanasiev, Valeri; Tomczak, Yoann; Sutar, Surajit; Leonhardt, Alessandra; Ludwig, Jonathan; Celano, Umberto; Brems, Steven; Dabral, Ashish; Pourtois, Geoffrey; Caymax, Matty; Schram, Tom; Huyghebaert, Cedric; Asselberghs, Inge; De Gendt, Stefan; Radu, Iuliana (2018)

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology

Chew, Soon Aik; Demuynck, Steven; Zhang, Liping; Pacco, Antoine; Devriendt, Katia; Teugels, Lieve; Hopf, Toby; Versluijs, Janko; Vrancken, Christa; Dangol, Anish; Altamirano Sanchez, Efrain; Mocuta, Dan; Horiguchi, Naoto (2018)

Evaluation of mechanical stress induced during IC packaging

Cherman, Vladimir; Lofrano, Melina; Gonzalez, Mario; Cadacio Jr., Francisco; Rebibis, Kenneth June; Beyne, Eric; Takano, Akihito; Higashi, Mitsutoshi (2018)

Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes

Cherian, Denis; Yoti Mitra, Kalyan; Hartwig, Melinda; Malinowski, Pawel; Baumann, Reinhard R. (2018)

Solid Composite Electrolytes for Lithium Ion Batteries

Chen, Xubin (2018-06)

Improved compressive tracking based on pixelwise learner

Chen, Ting; Sahli, Hichem; Zhang, Yanning; Yang, Tao (2018)

A hierarchical association framework for multi-object tracking in airborne videos

Chen, Ting; Pennisi, Andrea; Zhi, Li; Zhang, Yanning; Sahli, Hichem (2018)

ESD diodes in next generation bulk FinFET and GAA NW technology nodes

Chen, Shih-Hung; Hellings, Geert; Linten, Dimitri; Mertens, Hans; Chiarella, Thomas; Mitard, Jerome; Mocuta, Anda; Horiguchi, Naoto (2018)

ESD challenges in advanced FinFET and GAA nanowire CMOS technologies

Chen, Shih-Hung (2018)

Empirical Study on the Use of Client-side Web Security Mechanisms

Chen, Ping (2018-09)

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition

Chen, Mingyi; Castro Miller, Ivan Dario; Lin, Qiuyang; Torfs, Tom; Tavernier, Filip; Van Hoof, Chris; Van Helleputte, Nick (2018)

Integration of high-speed GaAs metal-semiconductor-metal photodetectors by means of transfer printing for 850 nm wavelength photonic interposers

Chen, Guanyu; Goyvaerts, Jeroen; Kumari, Sulakshna; Van Kerrebrouck, Joris; Muneeb, Muhammad; Uvin, Sarah; Yu, Yu; Roelkens, Gunther (2018-03)

imec Publications: Recent submissions

7.6% CZGSe solar cells thanks to optimized CdS chemical bath depostion ﻿

Agile management and interoperability testing of SDN/NFV-Enriched 5G core networks ﻿

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells ﻿

Passivating electron selective contacts for silicon solar cells based on an a-Si:H / TiOx stack and a low work function metal ﻿

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts ﻿

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide ﻿

Layer-controlled epitaxy of 2D semiconductors: bridging nanoscale phenomena to wafer-scale uniformity ﻿

Scalable, layer-controlled synthesis of 2D semiconductors ﻿

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials ﻿

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology ﻿

Evaluation of mechanical stress induced during IC packaging ﻿

Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes ﻿

Solid Composite Electrolytes for Lithium Ion Batteries ﻿

Improved compressive tracking based on pixelwise learner ﻿

A hierarchical association framework for multi-object tracking in airborne videos ﻿

ESD diodes in next generation bulk FinFET and GAA NW technology nodes ﻿

ESD challenges in advanced FinFET and GAA nanowire CMOS technologies ﻿

Empirical Study on the Use of Client-side Web Security Mechanisms ﻿

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition ﻿

Integration of high-speed GaAs metal-semiconductor-metal photodetectors by means of transfer printing for 850 nm wavelength photonic interposers ﻿