Recently added

A BLAS-based algorithm for finding position weight matrix occurrences in DNA sequences on CPUs and GPUs

Fostier, Jan (2018-04)

Zero and one-dimensional electrical characterization of nanometer-wide Si fins

Folkersma, Steven; Bogdanowicz, Janusz; Schulze, Andreas; Favia, Paola; Franquet, Alexis; Spampinato, Valentina; Petersen, Dirch; Hansen, Ole; Henrichsen, Henrik; Nielsen, Peter; Shiv, Lior; Vandervorst, Wilfried (2018)

Towards carrier profiling in nanometer-wide Si fins with micro four-point probe

Folkersma, Steven; Bogdanowicz, Janusz; Schulze, Andreas; Favia, Paola; Franquet, Alexis; Spampinato, Valentina; Petersen, Dirch H.; Hansen, Ole; Henrichsen, Henrik H.; Nielsen, Peter F.; Shiv, Lior; Vandervorst, Wilfried (2018)

Electrical characterization of single nanometer-wide Si fins in dense arrays

Folkersma, Steven; Bogdanowicz, Janusz; Schulze, Andreas; Favia, Paola; Dirch, Petersen; Ole, Hansen; Henrik, Henrichsen; Nielsen, Peter; Shiv, Lior; Vandervorst, Wilfried (2018)

Improving roadside units deployment in vehicular networks by exploiting genetic algorithms

Fogue, Manuel; Sanguesa, Julio A.; Martinez, Francisco J.; Marquez-Barja, Johann (2018)

A prospective cohort study of adolescents' memory performance and individual brain dose of microwave radiation from wireless communication

Foerster, Milena; Thielens, Arno; Joseph, Wout; Eeftens, Marloes; Röösli, Martin (2018-07)

Leading-edge wide-I/O2 memory probing challenges: TPEG(TM) MEMS solution

Fodor, Ferenc; Marinissen, Erik Jan; Acconcia, Daniele; Vallauri, Raffaele (2018-06)

Testing & diagnosis of fine-pitch wafers and advanced packages

Fodor, Ferenc; Marinissen, Erik Jan; Acconcia, Daniele; Bertarelli, Emanuele; Vallauri, Raffaele (2018)

Investigation of the endurance of FE-HfO2 devices by means of TDDB studies

Florent, Karine; Subirats, Alexandre; Lavizzari, Simone; Degraeve, Robin; Celano, Umberto; Kaczer, Ben; Di Piazza, Luca; Popovici, Mihaela Ioana; Groeseneken, Guido; Van Houdt, Jan (2018)

Vertical ferroelectric HfO2 FET based on 3-D NAND architecture: towards dense low-power memory

Florent, Karine; Pesic, Milan; Subirats, Alexandre; Banerjee, Kaustuv; Lavizzari, Simone; Arreghini, Antonio; Di Piazza, Luca; Potoms, Goedele; Sebaai, Farid; McMitchell, Sean; Popovici, Mihaela Ioana; Groeseneken, Guido; Van Houdt, Jan (2018)

Revealing the three-dimensional shape of atom probe tips by atomic force microscopy

Fleischmann, Claudia; Paredis, Kristof; Melkonyan, Davit; Vandervorst, Wilfried (2018)

3D imaging of atom probe tip shapes with atomic force microscopy

Fleischmann, Claudia; Paredis, Kristof; Melkonyan, Davit; Op de Beeck, Jonathan; Bogdanowicz, Janusz; Morris, Richard; Cuduvally, Ramya; Vandervorst, Wilfried (2018)

Creating 1 $lm RDL structures for fan-out wafer-level packaging

Flack, Warren; Slabbekoorn, John (2018)

One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Suhard, Samuel; Miller, Andy; Hiro, Akito; Hidremont, Romain (2018)

Unraveling the role of multiphonon excitations and disorder concerning the Meyer-Neldel type compensation effect in organic semiconductors

Fishchuk, Ivan; Bässler, Heinz; Köhler, Anna; Genoe, Jan; Kadashchuk, Andriy (2018)

A silicon-based neural probe with densely-packed low-impedance titanium nitride microelectrodes for ultrahigh-resolution in vivo recordings

Fiath, Richard; Raducanu, Bogdan; Musa, Silke; Andrei, Alexandru; Mora Lopez, Carolina; Van Hoof, Chris; Ruther, Patrick; Aarts, Arno; Horvath, Domonkos; Ulbert, Istvan (2018)

imec Publications: Recent submissions

A BLAS-based algorithm for finding position weight matrix occurrences in DNA sequences on CPUs and GPUs

Zero and one-dimensional electrical characterization of nanometer-wide Si fins

Towards carrier profiling in nanometer-wide Si fins with micro four-point probe

Electrical characterization of single nanometer-wide Si fins in dense arrays

Improving roadside units deployment in vehicular networks by exploiting genetic algorithms

A prospective cohort study of adolescents' memory performance and individual brain dose of microwave radiation from wireless communication

Leading-edge wide-I/O2 memory probing challenges: TPEG(TM) MEMS solution

Testing & diagnosis of fine-pitch wafers and advanced packages

Investigation of the endurance of FE-HfO2 devices by means of TDDB studies

Vertical ferroelectric HfO2 FET based on 3-D NAND architecture: towards dense low-power memory

Revealing the three-dimensional shape of atom probe tips by atomic force microscopy

3D imaging of atom probe tip shapes with atomic force microscopy

Creating 1 $lm RDL structures for fan-out wafer-level packaging

One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

Unraveling the role of multiphonon excitations and disorder concerning the Meyer-Neldel type compensation effect in organic semiconductors

Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process

A framework for the automation of LTE physical layer tests

Compact optomechanical phase shifter for visible light integrated photonics

The effects of narrow viewing on second language vocabulary learning over time

A silicon-based neural probe with densely-packed low-impedance titanium nitride microelectrodes for ultrahigh-resolution in vivo recordings

imec Publications: Recent submissions

A BLAS-based algorithm for finding position weight matrix occurrences in DNA sequences on CPUs and GPUs ﻿

Zero and one-dimensional electrical characterization of nanometer-wide Si fins ﻿

Towards carrier profiling in nanometer-wide Si fins with micro four-point probe ﻿

Electrical characterization of single nanometer-wide Si fins in dense arrays ﻿

Improving roadside units deployment in vehicular networks by exploiting genetic algorithms ﻿

A prospective cohort study of adolescents' memory performance and individual brain dose of microwave radiation from wireless communication ﻿

Leading-edge wide-I/O2 memory probing challenges: TPEG(TM) MEMS solution ﻿

Testing & diagnosis of fine-pitch wafers and advanced packages ﻿

Investigation of the endurance of FE-HfO2 devices by means of TDDB studies ﻿

Vertical ferroelectric HfO2 FET based on 3-D NAND architecture: towards dense low-power memory ﻿

Revealing the three-dimensional shape of atom probe tips by atomic force microscopy ﻿

3D imaging of atom probe tip shapes with atomic force microscopy ﻿

Creating 1 $lm RDL structures for fan-out wafer-level packaging ﻿

One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material ﻿

Unraveling the role of multiphonon excitations and disorder concerning the Meyer-Neldel type compensation effect in organic semiconductors ﻿

Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process ﻿

A framework for the automation of LTE physical layer tests ﻿

Compact optomechanical phase shifter for visible light integrated photonics ﻿

The effects of narrow viewing on second language vocabulary learning over time ﻿

A silicon-based neural probe with densely-packed low-impedance titanium nitride microelectrodes for ultrahigh-resolution in vivo recordings ﻿

A BLAS-based algorithm for finding position weight matrix occurrences in DNA sequences on CPUs and GPUs

Zero and one-dimensional electrical characterization of nanometer-wide Si fins

Towards carrier profiling in nanometer-wide Si fins with micro four-point probe

Electrical characterization of single nanometer-wide Si fins in dense arrays

Improving roadside units deployment in vehicular networks by exploiting genetic algorithms

A prospective cohort study of adolescents' memory performance and individual brain dose of microwave radiation from wireless communication

Leading-edge wide-I/O2 memory probing challenges: TPEG(TM) MEMS solution

Testing & diagnosis of fine-pitch wafers and advanced packages

Investigation of the endurance of FE-HfO2 devices by means of TDDB studies

Vertical ferroelectric HfO2 FET based on 3-D NAND architecture: towards dense low-power memory

Revealing the three-dimensional shape of atom probe tips by atomic force microscopy

3D imaging of atom probe tip shapes with atomic force microscopy

Creating 1 $lm RDL structures for fan-out wafer-level packaging

One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

Unraveling the role of multiphonon excitations and disorder concerning the Meyer-Neldel type compensation effect in organic semiconductors

Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process

A framework for the automation of LTE physical layer tests

Compact optomechanical phase shifter for visible light integrated photonics

The effects of narrow viewing on second language vocabulary learning over time

A silicon-based neural probe with densely-packed low-impedance titanium nitride microelectrodes for ultrahigh-resolution in vivo recordings