Recently added

Titanium silicide on Si:P with precontact amorphization implantation treatment: contact resistivity approaching 1×10-9 Ohm-cm²

Yu, Hao; Schaekers, Marc; Peter, Antony; Pourtois, Geoffrey; Rosseel, Erik; Lee, Joon-Gon; Song, Woo-Bin; Shin, Keo Myoung; Everaert, Jean-Luc; Chew, Soon Aik; Demuynck, Steven; Kim, Daeyong; Barla, Kathy; Mocuta, Anda; Horiguchi, Naoto; Thean, Aaron; Collaert, Nadine; De Meyer, Kristin (2016)

Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation

Yu, Hao; Schaekers, Marc; Hikavyy, Andriy; Rosseel, Erik; Peter, Antony; Hollar, K.; Khaja, Fareen; Aderhold, W.; Date, Lucien; Mayur, A.J.; Lee, J.G.; Shin, Keo Myoung; Douhard, Bastien; Chew, Soon Aik; Demuynck, Steven; Kubicek, Stefan; Kim, Daeyong; Mocuta, Anda; Barla, Kathy; Horiguchi, Naoto; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin (2016)

Process options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices

Yu, Hao; Schaekers, Marc; Demuynck, Steven; Rosseel, Erik; Everaert, Jean-Luc; Chew, Soon Aik; Peter, Antony; Kubicek, Stefan; Barla, Kathy; Mocuta, Anda; Horiguchi, Naoto; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin (2016)

MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond

Yu, Hao; Schaekers, Marc; Demuynck, Steven; Barla, Kathy; Mocuta, Anda; Horiguchi, Naoto; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin (2016)

Contact resistivities of metal-insulator-semiconductor contacts and metal-semiconductor contacts

Yu, Hao; Schaekers, Marc; Barla, Kathy; Horiguchi, Naoto; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin (2016)

Systematic study of interfacial reactions induced by metal electrodes in high-k/InGaAs gate stacks

Yoshida, Shinichi; Lin, Dennis; Vais, Abhitosh; Alian, AliReza; Franco, Jacopo; El Kazzi, Salim; Mols, Yves; Miyanami, Yuki; Nakazawa, Masashi; Collaert, Nadine; Watanabe, H; Thean, Aaron (2016)

First demonstration of real-time 100 Gbit/s 3-level duobinary transmission for optical interconnects

Yin, Xin; Verplaetse, M.; Lin, R.; Ozolins, O.; De Keulenaer, T.; Pang, X.; Pierco, R.; Vaernewyck, R.; Vyncke, Arno; Schatz, K.; Westergren, U.; Jacobsen, G.; Popov, S.; Chen, J.; Torfs, Guy; Bauwelinck, Johan (2016)

An asymmetric high serial rate TDM-PON with single carrier 25 Gb/s upstream and 50 Gb/s downstream

Yin, Xin; Van Kerrebrouck, Joris; Moeneclaey, Bart; Verbist, Jochem; Qiu, Xing-Zhi; Bauwelinck, Johan; Lanteri, Delphine; Blache, Fabrice; Achouche, Mohand; Demeester, Piet (2016-01)

Multi-level high speed burst-mode receivers

Yin, Xin; Van Kerrebrouck, Joris; Coudyzer, Gertjan; Bauwelinck, Johan (2016)

40-Gb/s TDM-PON downstream with low-cost EML transmitter and 3-level detection APD receiver

Yin, Xin; Blache, Fabrice; Moeneclaey, Bart; Van Kerrebrouck, Joris; Brenot, Romain; Coudyzer, Gertjan; Achouche, Mohand; Qiu, Xing-Zhi; Bauwelinck, Johan (2016)

Stochastic implementation of the activation function for articial neural networks

Yeo, Injune; Gi, Sang-gyun; Lee, Byung-geun; Chu, Myonglae (2016)

Non-destructive evaluation of an infusion process using capacitive sensing technique

Yang, Yang; Vervust, Thomas; Bossuyt, Frederick; Vanfleteren, Jan; Chiesura, Gabriele; Luyckx, Geert; Degrieck, Joris; Kaufmann, Markus (2016)

Capacitive sensor network for composites production monitoring

Yang, Yang; Plovie, Bart; Vervust, Thomas; Vanfleteren, Jan (2016)

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

Yang, Yang; Ding, Su; Araki, Teppei; Jiu, Jinting; Sugahara, Tohru; Wang, Jun; Vanfleteren, Jan; Sekitani, Tsuyoshi; Suganuma, Katsuaki (2016)

Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers

Yang, Yang; Chiesura, Gabriele; Vervust, Thomas; Degrieck, Joris; Vanfleteren, Jan (2016)

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

Yang, Yang; Chiesura, Gabriele; Vervust, Thomas; Bossuyt, Frederick; Luyckx, Geert; Degrieck, Joris; Vanfleteren, Jan (2016-06)

imec Publications: Recent submissions

Titanium silicide on Si:P with precontact amorphization implantation treatment: contact resistivity approaching 1×10-9 Ohm-cm²

Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation

Process options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices

MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond

Contact resistivities of metal-insulator-semiconductor contacts and metal-semiconductor contacts

Systematic study of interfacial reactions induced by metal electrodes in high-k/InGaAs gate stacks

First demonstration of real-time 100 Gbit/s 3-level duobinary transmission for optical interconnects

An asymmetric high serial rate TDM-PON with single carrier 25 Gb/s upstream and 50 Gb/s downstream

Multi-level high speed burst-mode receivers

40-Gb/s TDM-PON downstream with low-cost EML transmitter and 3-level detection APD receiver

Stochastic implementation of the activation function for articial neural networks

Non-destructive evaluation of an infusion process using capacitive sensing technique

Capacitive sensor network for composites production monitoring

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

Height uniformity of micro-bumps electroplated on thin Cu seed layers

Height uniformity of micro-bumps electroplated on thin Cu seed layers

Decision tree based depression classification from audio video and language information

The pnp web tag: a plug-and-play programming model for connecting iot devices to the web of things

imec Publications: Recent submissions

Titanium silicide on Si:P with precontact amorphization implantation treatment: contact resistivity approaching 1×10-9 Ohm-cm² ﻿

Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation ﻿

Process options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices ﻿

MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond ﻿

Contact resistivities of metal-insulator-semiconductor contacts and metal-semiconductor contacts ﻿

Systematic study of interfacial reactions induced by metal electrodes in high-k/InGaAs gate stacks ﻿

First demonstration of real-time 100 Gbit/s 3-level duobinary transmission for optical interconnects ﻿

An asymmetric high serial rate TDM-PON with single carrier 25 Gb/s upstream and 50 Gb/s downstream ﻿

Multi-level high speed burst-mode receivers ﻿

40-Gb/s TDM-PON downstream with low-cost EML transmitter and 3-level detection APD receiver ﻿

Stochastic implementation of the activation function for articial neural networks ﻿

Non-destructive evaluation of an infusion process using capacitive sensing technique ﻿

Capacitive sensor network for composites production monitoring ﻿

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light ﻿

Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers ﻿

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites ﻿

Height uniformity of micro-bumps electroplated on thin Cu seed layers ﻿

Height uniformity of micro-bumps electroplated on thin Cu seed layers ﻿

Decision tree based depression classification from audio video and language information ﻿

The pnp web tag: a plug-and-play programming model for connecting iot devices to the web of things ﻿

Titanium silicide on Si:P with precontact amorphization implantation treatment: contact resistivity approaching 1×10-9 Ohm-cm²

Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation

Process options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices

MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond

Contact resistivities of metal-insulator-semiconductor contacts and metal-semiconductor contacts

Systematic study of interfacial reactions induced by metal electrodes in high-k/InGaAs gate stacks

First demonstration of real-time 100 Gbit/s 3-level duobinary transmission for optical interconnects

An asymmetric high serial rate TDM-PON with single carrier 25 Gb/s upstream and 50 Gb/s downstream

Multi-level high speed burst-mode receivers

40-Gb/s TDM-PON downstream with low-cost EML transmitter and 3-level detection APD receiver

Stochastic implementation of the activation function for articial neural networks

Non-destructive evaluation of an infusion process using capacitive sensing technique

Capacitive sensor network for composites production monitoring

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

Height uniformity of micro-bumps electroplated on thin Cu seed layers

Height uniformity of micro-bumps electroplated on thin Cu seed layers

Decision tree based depression classification from audio video and language information

The pnp web tag: a plug-and-play programming model for connecting iot devices to the web of things