Recently added

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

Zhang, Boyao; Chew, Soon Aik; Stucchi, Michele; Dewilde, Sven; Iacovo, Serena; Witters, Liesbeth; Webers, Tomas; Van Sever, Koen; De Vos, Joeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2024)

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics

Van Asch, Jef; Missinne, Jeroen; He, Junwen; Xu, Pengfei; Podpod, Arnita; Lepage, Guy; Golshani, Negin; Magdziak, Rafal; Sar, Huseyin; Kobbi, Hakim; Bipul, Swetanshu; Bode, Dieter; Ban, Yoojin; Ferraro, Filippo; Van Campenhout, Joris; Van Steenberge, Geert (2024)

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects

Xu, Pengfei; Marchese, Chiara; Lepage, Guy; Golshani, Negin; Van Eenaeme, Ruben; Mingardi, Andrea; Van Ongeval, Joost; Magdziak, Rafal; Halipre, Luc; Trivkovic, Darko; Verheyen, Peter; Chakrabarti, Maumita; Velenis, Dimitrios; Miller, Andy; Ferraro, Filippo; Ban, Yoojin; Van Campenhout, Joris (2024)

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Xu, Pengfei; He, Junwen; Kennes, Koen; Dvoretskii, Anton; Podpod, Arnita; Lepage, Guy; Golshani, Negin; Magdziak, Rafal; Bipul, Swetanshu; Bode, Dieter; Verheyen, Peter; Chakrabarti, Maumita; Velenis, Dimitrios; Miller, Andy; Ban, Yoojin; Ferraro, Filippo; Van Campenhout, Joris (2024)

Controlled boron content in lightly B-doped single crystal diamond films by variation of methane concentration

Rouzbahani Bayatani, Rozita; Pobedinskas, Paulius; Donatini, Fabrice; Wong, Deniz; Pernot, Julien; Haenen, Ken (2024)

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

Wang, Jun; Mannarino, Manuel; Visker, Jakob; Kang, Shuo; Weidlinger, Gunther; Wernicke, Tobias; Burggraf, Jurgen; Wimplinger, Markus (2024)

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Ain, Kaneeze Noorul; Zhang, Guo Qi; Rodrigues, Augusto; Hasan, Md Nazmul; Holzmann, Dominik; Geens, Karen; Chatterjee, Urmimala; Roshanghias, Ali (2024)

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Hussain, Tassawar; Derakhshandeh, Jaber; Cochet, Tom; Beyne, Eric; Hsu, Jack; He, Dongming; De Wolf, Ingrid (2024)

Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms

Okudur, Oguzhan Orkut; Iacovo, Serena; Kang, Shuo; Gonzalez, Mario; Beyne, Eric (2024)

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper

Wang, Lili; Pak, Murat; Pinho, Nelson; Slabbekoorn, John; Miller, Andy; Beyne, Eric (2024)

Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

Chew, Soon Aik; Hung, Joey; Turovets, Igor; Saib, Mohamed; Ger, Avron; Moussa, Alain; Zhang, Boyao; De Vos, Joeri; Miller, Andy; Charley, Anne-Laure; Leray, Philippe; Beyne, Eric (2024)

Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding

Doppelbauer, David; Floetgen, Christoph; Gabas, Ignacio Gabriel Vicente; Iacovo, Serena; Brems, Steven; Beyne, Eric; Duchoslav, Jiri; Groiss, Heiko (2024)

High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Tunca Altintas, Bensu; Saib, Mohamed; Moussa, Alain; Chew, Soon Aik; Zhang, Boyao; De Vos, Joeri; Miller, Andy; Beyne, Eric; Lorusso, Gian; Charley, Anne-Laure; Bogdanowicz, Janusz; Kasai, Hiroaki; Hasumi, Kazuhisa; Mise, Nobuyuki; Osaki, Mayuka; Tanaka, Maki (2024)

Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications

Jedidi, Nader; Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Beyer, Gerald; Beyne, Eric (2024)

IMC Assisted Die-bonding for Stacked Device Integration

Maehara, Masataka; Derakhshandeh, Jaber; Gerets, Carine; Cochet, Tom; Cuypers, Dieter H.; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric (2024)

Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques

Leech, Damien; Hiro, Akito; Schoofs, Geert; Tunca Altintas, Bensu; Phommahaxay, Alain; Kennes, Koen; Beyer, Gerald; Beyne, Eric (2024)

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

Bex, Pieter; Gonzalez, Mario; Brems, Steven; Phommahaxay, Alain; D'Have, Koen; Dhakras, Prathamesh; Cuypers, Dieter H.; Lin, Ye; Beyne, Eric; Abdilla, Jonathan; Prince, Kawsar Ahmed; Auer, Benedikt; Bikaljevic, Djuro; Deubler, Manuel; Moura, Thiago; Schmid, Stefan; Seroglazov, Pavel (2024)

imec Publications: Recent submissions

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Controlled boron content in lightly B-doped single crystal diamond films by variation of methane concentration

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper

Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding

High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications

IMC Assisted Die-bonding for Stacked Device Integration

Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

The need for new materials in silicon photonics to enhance data throughput

Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC

imec Publications: Recent submissions

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch ﻿

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics ﻿

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects ﻿

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer ﻿

Controlled boron content in lightly B-doped single crystal diamond films by variation of methane concentration ﻿

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device ﻿

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects® ﻿

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials ﻿

Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms ﻿

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper ﻿

Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing ﻿

Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding ﻿

High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications ﻿

Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications ﻿

IMC Assisted Die-bonding for Stacked Device Integration ﻿

Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques ﻿

Overlay scaling error reduction for hybrid Die-To-Wafer bonding ﻿

The need for new materials in silicon photonics to enhance data throughput ﻿

Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet ﻿

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC ﻿

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Controlled boron content in lightly B-doped single crystal diamond films by variation of methane concentration

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper

Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding

High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications

IMC Assisted Die-bonding for Stacked Device Integration

Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

The need for new materials in silicon photonics to enhance data throughput

Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC