Recently added

LoRa 2.4 GHz communication link and range

Janssen, Thomas; Bni Lam, Noori; Aernouts, Michiel; Berkvens, Rafael; Weyn, Maarten (2020)

RSS-based localization and mobility evaluation using a single NB-IoT cell

Janssen, Thomas; Berkvens, Rafael; Weyn, Maarten (2020)

Benchmarking RSS-based Localization Algorithms with LoRaWAN

Janssen, Thomas; Berkvens, Rafael; Weyn, Maarten (2020)

Integrated calibration-free scannable structured light for fast high-resolution LiDAR

Jansen, Roelof; Prost, Mathias; Kjellman, Jon; Marinins, Aleksandrs; Soussan, Philippe; Dahlem, Marcus; Rottenberg, Xavier (2020)

Multilevel meta-analysis of multiple regression coefficients from single-case experimental studies

Jamshidi, Laleh; Declercq, Lies; Fernandez-Castilla, Belen; Ferron, John M.; Moeyaert, Mariola; Beretvas, S. Natasha; Van den Noortgate, Wim (2020)

Diagnostic validity of the pre-diabetes scale among at-risk rural Iranian adults for screening for pre-diabetes

Jahangiry, Leila; Shamizadeh, Tahereh; Sarbakhsh, Parvin; Abbasalizad Farhangi, Mahdieh; Ponnet, Koen (2020)

The psychometric properties of the Persian menopause rating scale

Jahangiry, Leila; Parviz, Robabeh; Mirghafourvand, Mojgan; Khazaee-Pool, Maryam; Ponnet, Koen (2020)

Risk perception related to COVID-19 among the Iranian general population : an application of the extended parallel process model

Jahangiry, Leila; Bakhtari, Fatemeh; Sohrabi, Zahara; Reihani, Parvin; Samei, Sirous; Ponnet, Koen; Montazeri, Ali (2020)

Oral health status and associated lifestyle behaviors in a sample of Iranian adults : an exploratory household survey

Jahangiry, Leila; Bagheri, Raziollah; Darabi, Fatemeh; Sarbakhsh, Parvin; Mehdi Naghibi Sistani, Mohammad; Ponnet, Koen (2020)

Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects

Jacobs, Kristof J.P.; Li, Yunlong; Stucchi, Michele; De Wolf, Ingrid; Van Huylenbroeck, Stefaan; De Vos, Joeri; Beyne, Eric (2020)

Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration

Jacobs, Kristof J.P.; Kim, Soon-Wook; De Wolf, Ingrid; Beyne, Eric (2020)

Modular verification of liveness properties of the I/O behavior of imperative programs

Jacobs, Bart (2020-10)

Evaluating human-robot interaction with ethnography

Jacobs, An; Elprama, Shirley; Jewell, Charlotte (2020-05)

The multi-faceted mechano-bactericidal mechanism of nanostructured surfaces

Ivanova, Elena; Linklater, Denver; Werner, Marco; Baulin, Vladimir; Xu, XiuMei; Vrancken, Nandi; Rubanov, Sergey; Hanssen, Eric; Wandiyanto, Jason; Truong, Vi Khanh; Elbourne, Aaron; Madaughlin, Shane; Juodkazis, Saulius; Crawford, Russell (2020)

CMOS compatible Josephson junctions for superonducting qubit applications

Ivanov, Tsvetan; Potocnik, Anton; Wan, Danny; Verjauw, Jeroen; Jussot, Julien; Mongillo, Massimo; Acharya, Rohith; Mohiyaddin, Fahd Ayyalil; Favia, Paola; Bender, Hugo; Goux, Ludovic; Govoreanu, Bogdan; Radu, Iuliana (2020)

Analysis of attention in child-robot interaction among children diagnosed with cognitive impairment

Ismail, Luthffi I.; Hanaplah, F.A.; Belpaeme, Tony; Dambre, Joni; Wyffels, Francis (2020)

User-driven design of robot costume for child-robot interactions among children with cognitive impairment

Ismail, L.I.; Hanapiah, F.A.; Wyffels, Francis (2020)

Recent advances in the study of content nnowledge and pedagogical content knowledge in physical education

Iserbyt, Peter; Insook, Kim; Ward, Phillip; Dervent, Fatih; Devrilmez, Erhan; Cotuk, Mufide; He, Yaohui; Wang, Xiaozan; He, Lang; Madou, Tom; Depaepe, Fien (2020)

Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

Inoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric (2020)

Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry

Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020)

imec Publications: Recent submissions

LoRa 2.4 GHz communication link and range ﻿

RSS-based localization and mobility evaluation using a single NB-IoT cell ﻿

Benchmarking RSS-based Localization Algorithms with LoRaWAN ﻿

Integrated calibration-free scannable structured light for fast high-resolution LiDAR ﻿

Multilevel meta-analysis of multiple regression coefficients from single-case experimental studies ﻿

Diagnostic validity of the pre-diabetes scale among at-risk rural Iranian adults for screening for pre-diabetes ﻿

The psychometric properties of the Persian menopause rating scale ﻿

Risk perception related to COVID-19 among the Iranian general population : an application of the extended parallel process model ﻿

Oral health status and associated lifestyle behaviors in a sample of Iranian adults : an exploratory household survey ﻿

Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects ﻿

Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration ﻿

Modular verification of liveness properties of the I/O behavior of imperative programs ﻿

Evaluating human-robot interaction with ethnography ﻿

The multi-faceted mechano-bactericidal mechanism of nanostructured surfaces ﻿

CMOS compatible Josephson junctions for superonducting qubit applications ﻿

Analysis of attention in child-robot interaction among children diagnosed with cognitive impairment ﻿

User-driven design of robot costume for child-robot interactions among children with cognitive impairment ﻿

Recent advances in the study of content nnowledge and pedagogical content knowledge in physical education ﻿

Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer ﻿

Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry ﻿