Recently added

Electrodeposition for die-to-wafer very high-density interconnect

Inoue, Fumihiro (2020)

Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay

Iacovo, Serena; De Vos, Joeri; Phommahaxay, Alain; Miller, Andy; Beyne, Eric (2020)

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Huynen, Martijn; Kapusuz, Kamil Yavuz; Sun, Xiao; Van der Plas, Geert; Beyne, Eric; De Zutter, Daniel; Vande Ginste, Dries (2020)

Platforms to develop 2d materials integrated with Si

Huyghebaert, Cedric (2020)

DUST Initializr - CAD drawing platform for designing modules and applications in the DUST framework

Huybrechts, Thomas; Vanneste, Simon; Eyckerman, Reinout; de Hoog, Jens; Mercelis, Siegfried; Hellinckx, Peter (2020)

A survey on the software and hardware-based influences on the worst-case execution time

Huybrechts, Thomas; Mercelis, Siegfried; Hellinckx, Peter (2020)

DUST Initializr - Graph-Based Platform for Designing Modules and Applications in the Revised DUST Framework

Huybrechts, Thomas; Eyckerman, Reinout; Van Den Langenbergh, Raf; Vanneste, Simon; Mercelis, Siegfried; Hellinckx, Peter (2020)

Deep-learning-based hyperlocal air quality monitoring for smart cities

Huu, Tien Do; Rodrigo, Esther; Hofman, Jelle; Nikolaou, Mania; Panzica La Manna, Valerio; Philips, Wilfried; Deligiannis, Nikolaos (2020)

Language grounded task-adaptation in reinforcement learning

Hutsebaut-Buysse, Matthias; Mets, Kevin; Latre, Steven (2020)

Pre-trained word embeddings for goal-conditional transfer learning in reinforcement learning

Hutsebaut-Buysse, Matthias; Mets, Kevin; Latre, Steven (2020)

The use of extended reality technologies for learning in industry

Hurkmans, B.; Rajagopal, K. (2020)

The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography

Humphris, Andrew; Moussa, Alain; Dusa, Mircea; Charley, Anne-Laure; Newman, Ellis; Goulden, Jenny; Feng, Lei; Bevis, Christopher (2020)

Electro-osmotic vortices promote the capture of folded proteins by PlyAB nanopores

Huang, Gang; Willems, Kherim; Bartelds, Mart; Van Dorpe, Pol; Soskine, Misha; Maglia, Giovanni (2020)

A deep level transient spectroscopy study of hole traps in GexSe1-x-based layers for ovonic threshold switching selectors

Hsu, Brent; Simoen, Eddy; Lin, Dennis; Stesmans, Andre; Goux, Ludovic; Delhougne, Romain; Carolan, Patrick; Bender, Hugo; Kar, Gouri Sankar (2020)

imec Publications: Recent submissions

Electrodeposition for die-to-wafer very high-density interconnect

Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Platforms to develop 2d materials integrated with Si

DUST Initializr - CAD drawing platform for designing modules and applications in the DUST framework

A survey on the software and hardware-based influences on the worst-case execution time

DUST Initializr - Graph-Based Platform for Designing Modules and Applications in the Revised DUST Framework

Deep-learning-based hyperlocal air quality monitoring for smart cities

Language grounded task-adaptation in reinforcement learning

Pre-trained word embeddings for goal-conditional transfer learning in reinforcement learning

The use of extended reality technologies for learning in industry

The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography

Electro-osmotic vortices promote the capture of folded proteins by PlyAB nanopores

A deep level transient spectroscopy study of hole traps in GexSe1-x-based layers for ovonic threshold switching selectors

Sub-µm a-IGZO, fully integrated, process improved, vertical diode for crosspoint arrays

Tough hybrid hydrogels adapted tot the iundergraduate laboratory

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring

Power Delivery Network (PDN) modeling for backside-PDN configurations with buried power rails and uTSVs

imec Publications: Recent submissions

Electrodeposition for die-to-wafer very high-density interconnect ﻿

Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay ﻿

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects ﻿

Platforms to develop 2d materials integrated with Si ﻿

DUST Initializr - CAD drawing platform for designing modules and applications in the DUST framework ﻿

A survey on the software and hardware-based influences on the worst-case execution time ﻿

DUST Initializr - Graph-Based Platform for Designing Modules and Applications in the Revised DUST Framework ﻿

Deep-learning-based hyperlocal air quality monitoring for smart cities ﻿

Language grounded task-adaptation in reinforcement learning ﻿

Pre-trained word embeddings for goal-conditional transfer learning in reinforcement learning ﻿

The use of extended reality technologies for learning in industry ﻿

The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography ﻿

Electro-osmotic vortices promote the capture of folded proteins by PlyAB nanopores ﻿

A deep level transient spectroscopy study of hole traps in GexSe1-x-based layers for ovonic threshold switching selectors ﻿

Sub-µm a-IGZO, fully integrated, process improved, vertical diode for crosspoint arrays ﻿

Tough hybrid hydrogels adapted tot the iundergraduate laboratory ﻿

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking ﻿

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking ﻿

A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring ﻿

Power Delivery Network (PDN) modeling for backside-PDN configurations with buried power rails and uTSVs ﻿

Electrodeposition for die-to-wafer very high-density interconnect

Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Platforms to develop 2d materials integrated with Si

DUST Initializr - CAD drawing platform for designing modules and applications in the DUST framework

A survey on the software and hardware-based influences on the worst-case execution time

DUST Initializr - Graph-Based Platform for Designing Modules and Applications in the Revised DUST Framework

Deep-learning-based hyperlocal air quality monitoring for smart cities

Language grounded task-adaptation in reinforcement learning

Pre-trained word embeddings for goal-conditional transfer learning in reinforcement learning

The use of extended reality technologies for learning in industry

The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography

Electro-osmotic vortices promote the capture of folded proteins by PlyAB nanopores

A deep level transient spectroscopy study of hole traps in GexSe1-x-based layers for ovonic threshold switching selectors

Sub-µm a-IGZO, fully integrated, process improved, vertical diode for crosspoint arrays

Tough hybrid hydrogels adapted tot the iundergraduate laboratory

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring

Power Delivery Network (PDN) modeling for backside-PDN configurations with buried power rails and uTSVs