Recently added

Integration of highly crystalline C8-BTBT thin-films into simple logic gates and circuits

Janneck, Robby; Nowack, Thomas; De Roose, Florian; Ali, Hany; Dehaene, Wim; Heremans, Paul; Genoe, Jan; Rolin, Cedric (2019)

Influence of solute concentration on meniscus-guided coating of highly crystalline organic thin films

Janneck, Robby; Karagiannis, Dimitrios; Heremans, Paul; Genoe, Jan; Rolin, Cedric (2019)

High Performance, High-Level Integration of Organic Transistors

Janneck, Robby (2019-01)

Radar signal processing for human identification by means of reservoir computing networks

Jalalvand, Azarakhsh; Vandersmissen, Baptist; De Neve, Wesley; Mannens, Erik (2019)

Prevalence of metabolic syndrome and its determinants among Iranian adults : evidence of IraPEN survey on a bi-ethnic population

Jahangiry, Leila; Khosravi-far, Leila; Sarbakhsh, Parvin; Kousha, Ahmad; EntezarMahdi, Rasool; Ponnet, Koen (2019)

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

Jacobs, Kristof J.P.; Li, Yunlong; Van Huylenbroeck, Stefaan; De Wolf, Ingrid; Beyne, Eric (2019)

How to do proofs? Practically proving properties about effectful programs' results (functional pearl)

Jacobs, Koen; Nuyts, Andreas; Devriese, Dminique (2019)

Enabling generic wireless coexistence through technology-agnostic dynamic spectrum access

Jabandzic, Irfan; Giannoulis, Spilios; Moerman, Ingrid (2019-05)

SDN-based slice orchestration and MAC management for QoS delivery in IEEE 802.11 networks

Isolani, Pedro Heleno; Cardona Cardenas, Nelson; Donato Morales, Carlos; Marquez-Barja, Johann; Granville, Lisandro; Latre, Steven (2019)

Leveraging robotics research for children with autism: A review

Ismail, L.; Verhoeven, Thibault; Dambre, Joni; Wyffels, Francis (2019-06)

Response pattern of child-robot interaction among children with cognitive impairment

Ismail, L.; Hanapiah, F.A.; Belpaeme, Tony; Wyffels, Francis (2019)

User perceptions of security and usability of mobile-based single password authentication and two-factor authentication

Isler, D.; Kupcu, A.; Coskun, Y. (2019)

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Ishikawa, Kenji; Ishijima, Tatsuo; Shirafuji, Tatsuru; Armini, Silvia; Despiau-Pujo, Emilie; Gottscho, Richard A; Leusink, Gert; Marchack, Nathan; Murayama, Takahide; Oehrlein, Gottlieb S.; Park, Sangwuk; Hayashi, Hisataka; Kinoshita, Keizo (2019)

imec Publications: Recent submissions

Integration of highly crystalline C8-BTBT thin-films into simple logic gates and circuits

Influence of solute concentration on meniscus-guided coating of highly crystalline organic thin films

High Performance, High-Level Integration of Organic Transistors

Radar signal processing for human identification by means of reservoir computing networks

Prevalence of metabolic syndrome and its determinants among Iranian adults : evidence of IraPEN survey on a bi-ethnic population

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

How to do proofs? Practically proving properties about effectful programs' results (functional pearl)

Enabling generic wireless coexistence through technology-agnostic dynamic spectrum access

SDN-based slice orchestration and MAC management for QoS delivery in IEEE 802.11 networks

Leveraging robotics research for children with autism: A review

Response pattern of child-robot interaction among children with cognitive impairment

User perceptions of security and usability of mobile-based single password authentication and two-factor authentication

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Global media flows: a qualitative review of research methods in audiovisual flow studies

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

Influence of composition of SiCN as interfacial layer on plasma activated direct bonding

Defect identification in bonding surface layer by positron annihilation spectroscopy

Protective layer for collective die to wafer hybrid bonding

Trustworthiness assessment of web applications using security coding practices

Smart cyber-physical system applications in production and logistics: special issue editorial

imec Publications: Recent submissions

Integration of highly crystalline C8-BTBT thin-films into simple logic gates and circuits ﻿

Influence of solute concentration on meniscus-guided coating of highly crystalline organic thin films ﻿

High Performance, High-Level Integration of Organic Transistors ﻿

Radar signal processing for human identification by means of reservoir computing networks ﻿

Prevalence of metabolic syndrome and its determinants among Iranian adults : evidence of IraPEN survey on a bi-ethnic population ﻿

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing ﻿

How to do proofs? Practically proving properties about effectful programs' results (functional pearl) ﻿

Enabling generic wireless coexistence through technology-agnostic dynamic spectrum access ﻿

SDN-based slice orchestration and MAC management for QoS delivery in IEEE 802.11 networks ﻿

Leveraging robotics research for children with autism: A review ﻿

Response pattern of child-robot interaction among children with cognitive impairment ﻿

User perceptions of security and usability of mobile-based single password authentication and two-factor authentication ﻿

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective ﻿

Global media flows: a qualitative review of research methods in audiovisual flow studies ﻿

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding ﻿

Influence of composition of SiCN as interfacial layer on plasma activated direct bonding ﻿

Defect identification in bonding surface layer by positron annihilation spectroscopy ﻿

Protective layer for collective die to wafer hybrid bonding ﻿

Trustworthiness assessment of web applications using security coding practices ﻿

Smart cyber-physical system applications in production and logistics: special issue editorial ﻿

Integration of highly crystalline C8-BTBT thin-films into simple logic gates and circuits

Influence of solute concentration on meniscus-guided coating of highly crystalline organic thin films

High Performance, High-Level Integration of Organic Transistors

Radar signal processing for human identification by means of reservoir computing networks

Prevalence of metabolic syndrome and its determinants among Iranian adults : evidence of IraPEN survey on a bi-ethnic population

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

How to do proofs? Practically proving properties about effectful programs' results (functional pearl)

Enabling generic wireless coexistence through technology-agnostic dynamic spectrum access

SDN-based slice orchestration and MAC management for QoS delivery in IEEE 802.11 networks

Leveraging robotics research for children with autism: A review

Response pattern of child-robot interaction among children with cognitive impairment

User perceptions of security and usability of mobile-based single password authentication and two-factor authentication

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Global media flows: a qualitative review of research methods in audiovisual flow studies

Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

Influence of composition of SiCN as interfacial layer on plasma activated direct bonding

Defect identification in bonding surface layer by positron annihilation spectroscopy

Protective layer for collective die to wafer hybrid bonding

Trustworthiness assessment of web applications using security coding practices

Smart cyber-physical system applications in production and logistics: special issue editorial