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Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
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Authors
Agnesina, Anthony
;
Brunion, Moritz
;
Kim, Jinwoo
;
Garcia-Ortiz, Alberto
;
Milojevic, Dragomir
;
Catthoor, Francky
;
Perumkunnil, Manu
;
Lim, Sung Kyu
DOI
10.1109/ISLPED52811.2021.9502475
EISBN
978-1-6654-3922-0
ISSN
1533-4678
Conference
IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)
Journal
na
Title
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
Publication type
Proceedings paper
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3
20.500.12860/37447.3
*
2022-03-30T09:22:49Z
validation by library/open access desk
2
20.500.12860/37447.2
2022-03-23T10:41:26Z
validation by imec author
1
20.500.12860/37447
2021-11-02T15:55:22Z
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