Browsing Conference contributions by imec author "23f367559dd9031027f0efe03c529218ea9006a9"
Now showing items 61-80 of 80
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Thermal analysis of 3D functional partitioning for high-performance systems
Oprins, Herman; Milojevic, Dragomir; Van der Plas, Geert; Beyne, Eric (2021-05) -
Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration
Oprins, Herman; Beyne, Eric (2019) -
Thermal analysis of advanced back-end-of-line structures and the impact of design parameters
Chang, Xinyue; Oprins, Herman; Lofrano, Melina; Vermeersch, Bjorn; Ciofi, Ivan; Varela Pedreira, Olalla; Tokei, Zsolt; De Wolf, Ingrid (2022-09-30) -
Thermal analysis of AlGaN/GaN HEMTs
Oprins, Herman; Das, Johan; Ruythooren, Wouter; Vandersmissen, Raf; Vandevelde, Bart; Germain, Marianne (2005-09) -
Thermal analysis of hot spots in advanced 3D-stacked structures
Torregiani, Cristina; Oprins, Herman; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2009) -
Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Van der Plas, Geert; Beyne, Eric; Baelmans, Martine (2019) -
Thermal aspects of 3D and 2.5D system integration
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Beyne, Eric (2017-01) -
Thermal Aspects of Silicon Photonic Interposer Packages
Oprins, Herman; Ban, Yoojin; Cherman, Vladimir; Van Campenhout, Joris (2020) -
Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2016-05) -
Thermal effects due to environmental variables in photovoltaic cells
Muthirayan, Buvana; Appels, Reinhart; Oprins, Herman; Chatterjee, Urmimala; Catthoor, Francky; Driesen, Johan; Baert, Kris (2012-06) -
Thermal experimental and modeling analysis of high power 3D packages
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Maggioni, Federica; De Vos, Joeri; Beyne, Eric (2015-06) -
Thermal performance comparison of advanced 3D packages for mobile applications
Oprins, Herman; Cherman, Vladimir; Beyne, Eric (2018-05) -
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Torregiani, Cristina; Stucchi, Michele; Vandevelde, Bart; Beyne, Eric (2010) -
Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch
Cherman, Vladimir; Van Huylenbroeck, Stefaan; Lofrano, Melina; Chang, Xinyue; Oprins, Herman; Gonzalez, Mario; Van der Plas, Geert; Beyer, Gerald; Rebibis, Kenneth June; Beyne, Eric (2020) -
Towards accurate temperature prediction in BEOL for reliability assessment (Invited)
Lofrano, Melina; Oprins, Herman; Chang, Xinyue; Vermeersch, Bjorn; Lesniewska, Alicja; Cherman, Vladimir; Ciofi, Ivan; Croes, Kristof; Park, Seongho; Tokei, Zsolt; Varela Pedreira, Olalla (2023) -
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)
Mishra, Subrat; Sankatali, Venkateswarlu; Vermeersch, Bjorn; Brunion, Moritz; Lofrano, Melina; Abdi, Dawit; Oprins, Herman; Biswas, Dwaipayan; Zografos, Odysseas; Hiblot, Gaspard; Van der Plas, Geert; Weckx, Pieter; Hellings, Geert; Myers, James; Catthoor, Francky; Ryckaert, Julien (2023) -
Transient analysis based thermal characterization of die-die interfaces in 3D-ICs
Oprins, Herman; Cherman, Vladimir; Rebibis, Kenneth June; Vermeersch, Kristina; Gerets, Carine; Vandevelde, Bart; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012-05) -
Understanding EM-degradation mechanisms in metal heaters used for Si Photonics applications
Croes, Kristof; Simons, Veerle; Cherman, Vladimir; Oprins, Herman; Absil, Philippe; Glabman, Aaron; Eric, Wilcox (2019) -
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
Van der Plas, Geert; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Limaye, Paresh; Mercha, Abdelkarim; Stucchi, Michele; Oprins, Herman; Vandevelde, Bart; Minas, Nikolaos; Cupak, Miroslav; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Beyne, Eric; Marchal, Pol (2010-09) -
Verifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
Marchal, Pol; Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Cherman, Vladimir; Oprins, Herman; Labie, Riet; Vandevelde, Bart; Travaly, Youssef; Beyne, Eric (2010)