Browsing Conference contributions by imec author "ba00fdae216da6c469dbaf80ee2ee11ae6408062"
Now showing items 1-11 of 11
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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023) -
Gemini-templated PMO low-k films
Redzheb, Murad; Armini, Silvia; Okudur, Oguzhan Orkut; Vanstreels, Kris; Bernstorff, Sigrid; Voort, Pascal Van Der; Baklanov, Mikhaïl (2016) -
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory
Kruv, Anastasiia; McMitchell, Sean; Clima, Sergiu; Okudur, Oguzhan Orkut; Ronchi, Nicolo; Van den Bosch, Geert; Gonzalez, Mario; De Wolf, Ingrid; Van Houdt, Jan (2021) -
Mechanical behavior of porous thin low-k films during nanoindentation
Okudur, Oguzhan Orkut; Vanstreels, Kris; Saleh, Ahmed Sobhi; Hangen, Ude; De Wolf, Ingrid (2019) -
Metrology for evaluating elastic and fracture properties of porous low dielectric constant materials
Okudur, Oguzhan Orkut; Vanstreels, Kris; Zahedmanesh, Houman; De Wolf, Ingrid (2015) -
Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication
Okudur, Oguzhan Orkut; Gonzalez, Mario; Van den Bosch, Geert; Rosmeulen, Maarten (2021-09) -
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
Beyne, Eric; Kim, Soon-Wook; Peng, Lan; Heylen, Nancy; De Messemaeker, Joke; Okudur, Oguzhan Orkut; Phommahaxay, Alain; Kim, Tae-Gon; Stucchi, Michele; Velenis, Dimitrios; Miller, Andy; Beyer, Gerald (2017) -
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress
Lee, Kookjin; Kaczer, Ben; Kruv, Anastasiia; Gonzalez, Mario; Eneman, Geert; Okudur, Oguzhan Orkut; Grill, Alexander; Franco, Jacopo; Vici, Andrea; Degraeve, Robin; De Wolf, Ingrid (2022) -
Stress induced densification of thin porous low-k films during nanoindentation
Okudur, Oguzhan Orkut; Redzheb, Murad; Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario; De Wolf, Ingrid (2018) -
Substrate independent mechanical properties of thin low dielectric constant materials
Okudur, Oguzhan Orkut; Vanstreels, Kris; Hangen, Ude; Qui, Anqi; De Wolf, Ingrid (2016) -
Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
Okudur, Oguzhan Orkut; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Zahedmanesh, Houman; Varela Pedreira, Olalla; Kim, Soon-Wook; Vanstreels, Kris; Beyne, Eric; De Wolf, Ingrid (2017)