Browsing Conference contributions by author "La Manna, Antonio"
Now showing items 41-56 of 56
-
Processing active devices on Si interposer and impact on cost
Velenis, Dimitrios; Detalle, Mikael; Hellings, Geert; Scholz, Mirko; Marinissen, Erik Jan; Van der Plas, Geert; La Manna, Antonio; Miller, Andy; Linten, Dimitri; Beyne, Eric (2015) -
Small pitch micro-bumping and experimental investigation for under filling 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; De Vos, Joeri; Bogaerts, Lieve; Gerets, Carine; Beyne, Eric (2012-09) -
Stacking aspects in the view of scaling
De Vos, Joeri; La Manna, Antonio; Daily, Robert; Rebibis, Kenneth June; Beyne, Eric (2012) -
Stress and bowing engineering in passive silicon interposer
Detalle, Mikael; Vandevelde, Bart; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2015) -
Study of 3D process impact on advanced CMOS devices
La Manna, Antonio; Guo, Wei; Van Huylenbroeck, Stefaan; Sirignano, Emilio; Cherman, Vladimir; Van der Plas, Geert; De Wachter, Bart; Phommahaxay, Alain; Jourdain, Anne; Beyer, Gerald; Beyne, Eric (2013) -
Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
The road towards fully hybrid CMOS imager sensors
De Vos, Joeri; Jourdain, Anne; Zhang, Wenqi; De Munck, Koen; De Moor, Piet; La Manna, Antonio (2011) -
Thermo mechanical challenges for processing and packaging stacked ultrathin wafers
Gonzalez, Mario; Vandevelde, Bart; La Manna, Antonio; Swinnen, Bart; Beyne, Eric (2013) -
Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits
Ivankovic, Andrej; Cherman, Vladimir; Vandevelde, Bart; Van der Plas, Geert; Rebibis, Kenneth June; La Manna, Antonio; Beyne, Eric; De Wolf, Ingrid; Vandepitte, Dirk (2011) -
Transient analysis based thermal characterization of die-die interfaces in 3D-ICs
Oprins, Herman; Cherman, Vladimir; Rebibis, Kenneth June; Vermeersch, Kristina; Gerets, Carine; Vandevelde, Bart; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012-05) -
Underfill material screening and process characterization for 3D stacking
Rebibis, Kenneth June; La Manna, Antonio; Gerets, Carine; Beyne, Eric; Daily, Robert; Capuz, Giovanni (2012) -
Use of Wafer Applied Under Fill for 3D Stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2011) -
Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013) -
Wafer thinning and back side processing to enable 3D stacking
Detalle, Mikael; Bogaerts, Lieve; La Manna, Antonio; Buisson, Thibault; Velenis, Dimitrios; Beyne, Eric (2012) -
Wafer-level hermetic packaging for bio-medical applications
La Manna, Antonio (2010) -
Whisker evaluations in 3D microbump structures
Vakanas, George; Vandecasteele, Bjorn; De Messemaeker, Joke; Willems, Geert; La Manna, Antonio; Pei, Fei; Chason, Eric; Hua, Fay; De Wolf, Ingrid (2014)