Recently added

Optical delay inverse weight compensation with graphene electro absorption modulators

Sorianello, V.; Contestabile, G.; Midrio, M.; Pantouvaki, Marianna; Asselberghs, Inge; Van Campenhout, Joris (2019)

Advanced waveguide bends for photonic integrated circuits

Song, Jeonghwan; Kongnyuy, Tangla David; Hosseini, Naser; Stassen, Andim; Jansen, Roelof; Rottenberg, Xavier (2019)

PeriScope: An effective probing and fuzzing framework for the hardware-OS boundary

Song, Dokyung; Hetzelt, Felicitas; Das, Dipanjan; Spensky, Chad; Na, Yeoul; Volckaert, Stijn; Vigna, Giovanni; Kruegel, Christoper; Seifert, Jean-pierre; Franz, Michael (2019)

Mobile therapeutic attention for treatment-resistant schizophrenia: a prospective multicenter feasibility study in patients, caregivers and clinicians

Solis, Alonso; Grasa, E; Rubinstein, K; Van Der Graaf, Shenja; Jewell, Charlotte (2019)

Area-selective deposition on nanoscale metal/dielectric patterns by surface-dependent dimethylamino-trimethylsilane reaction

Soethoudt, Job; Tomczak, Yoann; Delabie, Annelies (2019)

Surface diffusion for defect mitigation during area-selective deposition of Ru

Soethoudt, Job; Grillo, Fabio; Marques, Esteban; Van Ommen, Ruud; Hody, Hubert; Delabie, Annelies (2019)

SLA-controlled proxy service through customisable MANO supporting operator policies

Soenen, Thomas; Vicens, F.; Bonnet, J.; Parada, C.; Kapassa, E.; Touloupou, M.; Fotopoulou, E.; Zafeiropoulos, A.; Poll, A.; Kolometsos, S.; Xilouris, G.; Alemany, P.; Vilalta, R.; Trakadas, P.; Karkazis, P.; Peuster, M.; Tavernier, Wouter (2019)

Dynamic logic reconfiguration based side-channel protection of AES and Serpent

Socha, P.; Brejnik, J.; Jerabek, S.; Novotny, M.; Mentens, N. (2019)

Ultra-scaled MOCVD MoS2 MOSFETs with 42nm contacted pitch and 250μA/μm drain current

Smets, Quentin; Arutchelvan, Goutham; Jussot, Julien; Verreck, Devin; Asselberghs, Inge; Nalin Mehta, Ankit; Gaur, Abhinav; Lin, Dennis; El Kazzi, Salim; Groven, Benjamin; Caymax, Matty; Radu, Iuliana (2019)

TaaS: Commodity MPC via Triples-as-a-Service

Smart, Nigel; Tanguy, T. (2019)

Error detection in monotone span programs with application to communication-efficient multi-party computation

Smart, N.P.; Wood, T. (2019)

Distributing any elliptic curve based protocol

Smart, N.; Talibi Alaoui, Y. (2019)

Compensating defects in epitaxial Ge and GexSn1-x

Slotte, Jonatan; Khanam, Afrina; Vohra, Anurag; Makkonen, Ilja; Loo, Roger; Pourtois, Geoffrey; Porret, Clément; Vandervorst, Wilfried (2019)

Automatic detection of welding defects using the convolutional neural network

Sizyakin, Roman; Voronin, Viacheslav; Gapon, Nikolay; Zelensky, Aleksandr; Pizurica, Aleksandra (2019)

Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route

Sisto, Giuliano; Chou, Richard; Milojevic, Dragomir (2019)

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Sirbu, B.; Eichhammer, Y.; Oppermann, H.; Tekin, T.; Kraft, J.; Sidorov, V.; Yin, Xin; Bauwelinck, Johan; Neumeyr, C.; Soares, F. (2019)

Conference contributions: Recent submissions

Optical delay inverse weight compensation with graphene electro absorption modulators

Advanced waveguide bends for photonic integrated circuits

PeriScope: An effective probing and fuzzing framework for the hardware-OS boundary

Mobile therapeutic attention for treatment-resistant schizophrenia: a prospective multicenter feasibility study in patients, caregivers and clinicians

Area-selective deposition on nanoscale metal/dielectric patterns by surface-dependent dimethylamino-trimethylsilane reaction

Surface diffusion for defect mitigation during area-selective deposition of Ru

SLA-controlled proxy service through customisable MANO supporting operator policies

Dynamic logic reconfiguration based side-channel protection of AES and Serpent

Ultra-scaled MOCVD MoS2 MOSFETs with 42nm contacted pitch and 250μA/μm drain current

TaaS: Commodity MPC via Triples-as-a-Service

Error detection in monotone span programs with application to communication-efficient multi-party computation

Distributing any elliptic curve based protocol

Compensating defects in epitaxial Ge and GexSn1-x

Automatic detection of welding defects using the convolutional neural network

Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Privacy risk assessment for data subject-aware threat modeling

Towards automated security design flaw detection

An architectural view for data protection by design

Temperatured dependent resistivity of alternative metal thin films

Conference contributions: Recent submissions

Optical delay inverse weight compensation with graphene electro absorption modulators ﻿

Advanced waveguide bends for photonic integrated circuits ﻿

PeriScope: An effective probing and fuzzing framework for the hardware-OS boundary ﻿

Mobile therapeutic attention for treatment-resistant schizophrenia: a prospective multicenter feasibility study in patients, caregivers and clinicians ﻿

Area-selective deposition on nanoscale metal/dielectric patterns by surface-dependent dimethylamino-trimethylsilane reaction ﻿

Surface diffusion for defect mitigation during area-selective deposition of Ru ﻿

SLA-controlled proxy service through customisable MANO supporting operator policies ﻿

Dynamic logic reconfiguration based side-channel protection of AES and Serpent ﻿

Ultra-scaled MOCVD MoS2 MOSFETs with 42nm contacted pitch and 250μA/μm drain current ﻿

TaaS: Commodity MPC via Triples-as-a-Service ﻿

Error detection in monotone span programs with application to communication-efficient multi-party computation ﻿

Distributing any elliptic curve based protocol ﻿

Compensating defects in epitaxial Ge and GexSn1-x ﻿

Automatic detection of welding defects using the convolutional neural network ﻿

Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route ﻿

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI ﻿

Privacy risk assessment for data subject-aware threat modeling ﻿

Towards automated security design flaw detection ﻿

An architectural view for data protection by design ﻿

Temperatured dependent resistivity of alternative metal thin films ﻿

Optical delay inverse weight compensation with graphene electro absorption modulators

Advanced waveguide bends for photonic integrated circuits

PeriScope: An effective probing and fuzzing framework for the hardware-OS boundary

Mobile therapeutic attention for treatment-resistant schizophrenia: a prospective multicenter feasibility study in patients, caregivers and clinicians

Area-selective deposition on nanoscale metal/dielectric patterns by surface-dependent dimethylamino-trimethylsilane reaction

Surface diffusion for defect mitigation during area-selective deposition of Ru

SLA-controlled proxy service through customisable MANO supporting operator policies

Dynamic logic reconfiguration based side-channel protection of AES and Serpent

Ultra-scaled MOCVD MoS2 MOSFETs with 42nm contacted pitch and 250μA/μm drain current

TaaS: Commodity MPC via Triples-as-a-Service

Error detection in monotone span programs with application to communication-efficient multi-party computation

Distributing any elliptic curve based protocol

Compensating defects in epitaxial Ge and GexSn1-x

Automatic detection of welding defects using the convolutional neural network

Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Privacy risk assessment for data subject-aware threat modeling

Towards automated security design flaw detection

An architectural view for data protection by design

Temperatured dependent resistivity of alternative metal thin films