Recently added

Design for hybrid SOI/silicon nitride high cooperativity optomechanical cavity

Tiebot, Paul; Kuyken, Bart; Van Thourhout, Dries (2016)

An improved CMP process for integration of high mobility channel materials

Teugels, Lieve; Ong, Patrick; Usman Ibrahim, Ansar; Delande, Tinne; Bhonsle, Rithu; Siebert, Max; Garcia Romero, Ivan; Struyf, Herbert; Leunissen, Leonardus (2016)

An improved CMP process for integration of high mobility channel materials

Teugels, Lieve; Ong, Patrick; Ansar, Sheik; Delande, Tinne; Bhonsle, Rithu; Siebert, Max; Garcia Romero, Ivan; Struyf, Herbert; Leunissen, Leonardus (2016)

Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

Teugels, Lieve; Devriendt, Katia; Heylen, Nancy; Tsvetanova, Diana; Struyf, Herbert; Bast, Gerhard; Ramkhalawon, Roshita; Mueller, Dieter; Simpson, Gavin; Ulea, Neli (2016)

Inversion optimization in majority-inverter graphs

Testa, Eleonora; Soeken, Mathias; Zografos, Odysseas; Amaru, Luca; Raghavan, Praveen; Lauwereins, Rudy; Gaillardon, Pierre-Emmaneul; De Micheli, Giovanni (2016)

Planar waveguide Bragg grating sensors for composite monitoring

Teigell Beneitez, Nuria; Missinne, Jeroen; Chiesura, Gabriele; Luyckx, Geert; Degrieck, Joris; Van Steenberge, Geert (2016)

Understanding the degradation sources under ON-state stress in AlGaN/GaN-on-Si SBD: Investigation of the anode-cathode apacing length dependence

Tallarico, Andrea; Magnone, Paolo; Stoffels, Steve; Lenci, Silvia; Hu, Jie; Marcon, Denis; Sangiorgi, Enrico; Decoutere, Stefaan; Fiegna, Claudio (2016)

Cryogenic cooling post MgO promoting the free layer coercivity and TMR in perpendicular bottom pinned Co/Ni STT-MRAM device stacks

Swerts, Johan; Mertens, Sofie; Couet, Sebastien; Lin, Tsann; Liu, Enlong; Rao, Siddharth; Kim, Woojin; Van Elshocht, Sven; Kar, Gouri Sankar; Furnemont, Arnaud; Nishimura, Kazumasa; Okuyama, Hiroki; Seino, Takuya; Tsunekawa, Koji (2016)

The influence of solvents on the quality of SAMs for low-k pore sealing purpose

Sun, Yiting; de Roover, Roel; Struyf, Herbert; De Feyter, Steven; Armini, Silvia (2016)

Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

Sun, Xiao; Rack, Martin; Van der Plas, Geert; Stucchi, Michele; De Vos, Joeri; Absil, Philippe; Raskin, J.P.; Beyne, Eric (2016)

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification

Suhard, Samuel; Li, Yunlong; Iwasaki, Akihisa; Van Huylenbroeck, Stefaan; Draper, Simon; Mizutani, Atsushi; Dory, Thomas; Holsteyns, Frank (2016)

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank (2016)

Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory

Subirats, Alexandre; Capogreco, Elena; Degraeve, Robin; Arreghini, Antonio; Van den Bosch, Geert; Linten, Dimitri; Van Houdt, Jan; Furnemont, Arnaud (2016)

In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories

Subirats, Alexandre; Arreghini, Antonio; Van den Bosch, Geert; Degraeve, Robin; Linten, Dimitri; Furnemont, Arnaud (2016-05)

Extensive reliability investigation of a-VMCO nonfilamentary RRAM: relaxation, retention and key differences to filamentary switching

Subhechha, Subhali; Govoreanu, Bogdan; Chen, Yangyin; Clima, Sergiu; De Meyer, Kristin; Van Houdt, Jan; Jurczak, Gosia (2016)

Growth and implementation of carbon-doped AlGaN layers for enhancement-mode HEMTs on 200 mm Si substrates

Su, Jie; Posthuma, Niels; Wellekens, Dirk; Saripalli, Yoga; Decoutere, Stefaan; Arif, Ronald; Papasouliotis, George (2016)

Metal oxide EUV photoresist performance for N7 relevant patterns and processes

Stowers, Jason; Anderson, Jeremy; Cardineau, Brian; Clark, Benjamin; De Schepper, Peter; Edson, Joseph; Greer, Michael; Jiang, Kai; Kocsis, Michael; Meyers, Stephen; Telecky, Alan; Grenville, Andrew; De Simone, Danilo; Gillijns, Werner; Vandenberghe, Geert (2016)

Conference contributions: Recent submissions

Design for hybrid SOI/silicon nitride high cooperativity optomechanical cavity

An improved CMP process for integration of high mobility channel materials

An improved CMP process for integration of high mobility channel materials

Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

Inversion optimization in majority-inverter graphs

Planar waveguide Bragg grating sensors for composite monitoring

Understanding the degradation sources under ON-state stress in AlGaN/GaN-on-Si SBD: Investigation of the anode-cathode apacing length dependence

Cryogenic cooling post MgO promoting the free layer coercivity and TMR in perpendicular bottom pinned Co/Ni STT-MRAM device stacks

The influence of solvents on the quality of SAMs for low-k pore sealing purpose

Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory

In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories

Extensive reliability investigation of a-VMCO nonfilamentary RRAM: relaxation, retention and key differences to filamentary switching

Growth and implementation of carbon-doped AlGaN layers for enhancement-mode HEMTs on 200 mm Si substrates

Metal oxide EUV photoresist performance for N7 relevant patterns and processes

Capturing true workload dependency of BTI-induced degradation in CPU components

50Gb/s C-band GeSi waveguide electro-absorption modulator

Phosphorus doped Ge layers for optical applications

Conference contributions: Recent submissions

Design for hybrid SOI/silicon nitride high cooperativity optomechanical cavity ﻿

An improved CMP process for integration of high mobility channel materials ﻿

An improved CMP process for integration of high mobility channel materials ﻿

Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system ﻿

Inversion optimization in majority-inverter graphs ﻿

Planar waveguide Bragg grating sensors for composite monitoring ﻿

Understanding the degradation sources under ON-state stress in AlGaN/GaN-on-Si SBD: Investigation of the anode-cathode apacing length dependence ﻿

Cryogenic cooling post MgO promoting the free layer coercivity and TMR in perpendicular bottom pinned Co/Ni STT-MRAM device stacks ﻿

The influence of solvents on the quality of SAMs for low-k pore sealing purpose ﻿

Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning ﻿

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification ﻿

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring ﻿

Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory ﻿

In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories ﻿

Extensive reliability investigation of a-VMCO nonfilamentary RRAM: relaxation, retention and key differences to filamentary switching ﻿

Growth and implementation of carbon-doped AlGaN layers for enhancement-mode HEMTs on 200 mm Si substrates ﻿

Metal oxide EUV photoresist performance for N7 relevant patterns and processes ﻿

Capturing true workload dependency of BTI-induced degradation in CPU components ﻿

50Gb/s C-band GeSi waveguide electro-absorption modulator ﻿

Phosphorus doped Ge layers for optical applications ﻿

Design for hybrid SOI/silicon nitride high cooperativity optomechanical cavity

An improved CMP process for integration of high mobility channel materials

An improved CMP process for integration of high mobility channel materials

Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

Inversion optimization in majority-inverter graphs

Planar waveguide Bragg grating sensors for composite monitoring

Understanding the degradation sources under ON-state stress in AlGaN/GaN-on-Si SBD: Investigation of the anode-cathode apacing length dependence

Cryogenic cooling post MgO promoting the free layer coercivity and TMR in perpendicular bottom pinned Co/Ni STT-MRAM device stacks

The influence of solvents on the quality of SAMs for low-k pore sealing purpose

Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory

In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories

Extensive reliability investigation of a-VMCO nonfilamentary RRAM: relaxation, retention and key differences to filamentary switching

Growth and implementation of carbon-doped AlGaN layers for enhancement-mode HEMTs on 200 mm Si substrates

Metal oxide EUV photoresist performance for N7 relevant patterns and processes

Capturing true workload dependency of BTI-induced degradation in CPU components

50Gb/s C-band GeSi waveguide electro-absorption modulator

Phosphorus doped Ge layers for optical applications