Recently added

In-air ultrasonic 3D-touchscreen with gesture recognition using existing hardware for smart devices

Van Dam, Bert; Murillo, Yuri; Li, Min; Pollin, Sofie (2016)

Thermal stability extraction from single perpendicular MTJs and Mbit arrays: comparison and statistical analysis

Van Beek, Simon; Martens, Koen; Roussel, Philippe; Kim, Woojin; Swerts, Johan; Donadio, Gabriele Luca; Kar, Gouri Sankar; Thean, Aaron; Furnemont, Arnaud; Groeseneken, Guido (2016)

Voltage acceleration and pulse dependence of barrier breakdown in MgO based magnetic tunnel junctions

Van Beek, Simon; Martens, Koen; Roussel, Philippe; Donadio, Gabriele Luca; Swerts, Johan; Mertens, Sofie; Thean, Aaron; Kar, Gouri Sankar; Furnemont, Arnaud; Groeseneken, Guido (2016)

Impact of wafer thinning on front-end reliability for 3D integration

Vaisman Chasin, Adrian; Scholz, Mirko; Guo, Wei; Franco, Jacopo; Potoms, Goedele; Jourdain, Anne; Linten, Dimitri; Van der Plas, Geert; Absil, Philippe; Beyne, Eric (2016)

Hot-carrier analysis on nMOS Si finFETs with solid source doped junctions

Vaisman Chasin, Adrian; Franco, Jacopo; Ritzenthaler, Romain; Hellings, Geert; Cho, Moon Ju; Sasaki, Yuichiro; Subirats, Alexandre; Roussel, Philippe; Kaczer, Ben; Linten, Dimitri; Horiguchi, Naoto; Groeseneken, Guido; Thean, Aaron (2016)

Record mobility (μeff ~3100 cm²/V-s) and reliability performance (Vov~0.5V for 10yr operation) of In0.53Ga0.47As MOS devices using improved surface preparation and a novel interfacial layer

Vais, Abhitosh; Alian, AliReza; Nyns, Laura; Franco, Jacopo; Sioncke, Sonja; Putcha, Vamsi; Yu, Hao; Mols, Yves; Rooyackers, Rita; Lin, Dennis; Maes, Jan; Xie, Qi; Givens, M.; Tang, F.; Jiang, X.; Mocuta, Anda; Collaert, Nadine; De Meyer, Kristin; Thean, Aaron (2016)

Characterizing and modeling electrical response to light for metal based EUV photoresists

Vaglio Pret, Alessandro; Kocsis, Michael; De Simone, Danilo; Vandenberghe, Geert; Stowers, Jason; Giglia, Angelo; De Schepper, Peter; Mani, Antonio; Biafore, John J. (2016)

Narrow line width injection-locked III-V-on-silicon mode-locked laser

Uvin, Sarah; Keyvaninia, Shahram; Lelarge, Francois; Duan, Guang-Hua; Kuyken, Bart; Roelkens, Gunther (2016)

Analysis of NBTI effects on high frequency digital circuits

Unutulmaz, Ahmet; Helms, Domenik; Eilers, Reef; Metzdorf, Malte; Kaczer, Ben; Nebel, Wolfgang (2016)

Runtime management of adaptive MPSoCs for graceful degradation

Tzilis, Stavros; Sourdis, Ioannis; Vasilikos, Vasileios; Rodopoulos, Dimitrios; Soudris, Dimitrios (2016)

Data compression for snapshot mosaic hyperspectral image sensors

Tzagkarakis, George; Charle, Wouter; Tsakalides, Panagiotis (2016)

Density-balancing mask sssignment for via patterning with directed self-assembly

Tung, Maryann C.; Guo, Daifeng; Karageorgos, Ioannis; Wong, Martin D. F.; Wong, H.-S. Philip (2016-10)

Design strategy for layout of Sub-Resolution Directed Self-Assembly Assist Features (SDRAFs)

Tung, C. Maryann; Doise, Jan; Karageorgos, Ioannis; Ryckaert, Julien; Wong, H.-S. Philip (2016)

CMP process steps for the fabrication of spin-transfer torque magnetic random access memory

Tsvetanova, Diana; Heylen, Nancy; Teugels, Lieve; Crotti, Davide; Donadio, Gabriele Luca; Kar, Gouri Sankar; Struyf, Herbert; Souriau, Laurent; Mertens, Sofie; Swerts, Johan; Couet, Sebastien; Lin, Tsann; Paraschiv, Vasile; Kim, Woojin; Rao, Siddharth (2016)

Non-negative matrix completion for the enhancement of snapshot mosaic multispectral imagery

Tsagkatakis, Grigorios; Jayapala, Murali; Geelen, Bert; Tsakalides, Panagiotis (2016)

Energy-efficient double relay communication protocol in cellular networks

Torrea Duran, Rodolfo; Rosas, Fernando; Pollin, Sofie; Vandendorpe, Luc; Mooned, Marc (2016)

A Co/Ni-based perpendicular magnetic tunnel junction (p-MTJ) stack with improved reference layer for BEOL compatibility

Tomczak, Yoann; Lin, Tsann; Swerts, Johan; Couet, Sebastien; Mertens, Sofie; Liu, Enlong; Kim, Woojin; Sankaran, Kiroubanand; Pourtois, Geoffrey; Tsvetanova, Diana; Souriau, Laurent; Van Elshocht, Sven; Kar, Gouri Sankar; Furnemont, Arnaud (2016)

On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control

Tokei, Zsolt; Ciofi, Ivan; Roussel, Philippe; Debacker, Peter; Raghavan, Praveen; van der Veen, Marleen; Jourdan, Nicolas; Wilson, Chris; Vega Gonzalez, Victor; Adelmann, Christoph; Wen, Liang Gong; Croes, Kristof; Varela Pedreira, Olalla; Moors, Kristof; Krishtab, Mikhail; Armini, Silvia; Boemmels, Juergen (2016)

End of Cu roadmap and beyond Cu

Tokei, Zsolt (2016)

Silicon socket layer for highly tunable phonon-phonon coupling in integrated circuits

Tiebot, Paul; Van Laer, Raphael; Kuyken, Bart; Van Thourhout, Dries (2016)

Conference contributions: Recent submissions

In-air ultrasonic 3D-touchscreen with gesture recognition using existing hardware for smart devices ﻿

Thermal stability extraction from single perpendicular MTJs and Mbit arrays: comparison and statistical analysis ﻿

Voltage acceleration and pulse dependence of barrier breakdown in MgO based magnetic tunnel junctions ﻿

Impact of wafer thinning on front-end reliability for 3D integration ﻿

Hot-carrier analysis on nMOS Si finFETs with solid source doped junctions ﻿

Record mobility (μeff ~3100 cm²/V-s) and reliability performance (Vov~0.5V for 10yr operation) of In0.53Ga0.47As MOS devices using improved surface preparation and a novel interfacial layer ﻿

Characterizing and modeling electrical response to light for metal based EUV photoresists ﻿

Narrow line width injection-locked III-V-on-silicon mode-locked laser ﻿

Analysis of NBTI effects on high frequency digital circuits ﻿

Runtime management of adaptive MPSoCs for graceful degradation ﻿

Data compression for snapshot mosaic hyperspectral image sensors ﻿

Density-balancing mask sssignment for via patterning with directed self-assembly ﻿

Design strategy for layout of Sub-Resolution Directed Self-Assembly Assist Features (SDRAFs) ﻿

CMP process steps for the fabrication of spin-transfer torque magnetic random access memory ﻿

Non-negative matrix completion for the enhancement of snapshot mosaic multispectral imagery ﻿

Energy-efficient double relay communication protocol in cellular networks ﻿

A Co/Ni-based perpendicular magnetic tunnel junction (p-MTJ) stack with improved reference layer for BEOL compatibility ﻿

On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control ﻿

End of Cu roadmap and beyond Cu ﻿

Silicon socket layer for highly tunable phonon-phonon coupling in integrated circuits ﻿