Recently added

Small pitch, high aspect ratio via-last TSV module

Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric (2016)

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi (2016)

The doctor prescribes silicon - Healthcare in the 21st century

Van Hoof, Chris (2016)

Living longer and healthier: persuasive wearable technology for prevention, cure and care

Van Hoof, Chris (2016)

Sensor interfaces for IoE

Van Helleputte, Nick (2016)

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator

Van Gasse, Kasper; Wang, Zhechao; Uvin, Sarah; De Deckere, B.; Marien, J.; Thomassen, L.; Roelkens, Gunther (2016)

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate

Van Gasse, Kasper; Wang, Zhechao; Moskalenko, V.; Latkowski, S.; Kuyken, Bart; Bente, E.; Roelkens, Gunther (2016)

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser

Van Gasse, Kasper; Van Kerrebrouck, Joris; Abbasi, Amin; Torfs, Guy; Chen, Hongtao; Yin, Xin; Bauwelinck, Johan; Roelkens, Gunther (2016)

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

Van Erps, Jurgen; Ciuk, Tymoteusz; Pasternak, Iwona; Krajewska, Aleksandra; Strupinski, Wlodek; Van Put, Steven; Van Steenberge, Geert; Baert, Kitty; Terryn, Herman; Thienpont, Hugo; Vermeulen, Nathalie (2016)

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs

Van Engelen, J.P.; Shen, Longfei; van der Tol, J.J.G.M.; Roelkens, Gunther; Smit, M. (2016)

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling

Van Engelen, J. P.; Shen, L.; Roelkens, Gunther; Jiao, Y.; Smit, M. K.; van der Tol, J. J. G. M. (2016)

Silicon nitride based planar integrated circuits for biophotonics applications

Van Dorpe, Pol (2016)

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes

van Dorp, Dennis; Arnauts, Sophia; Abrenica, Graniel; Holsteyns, Frank (2016)

Conference contributions: Recent submissions

Small pitch, high aspect ratio via-last TSV module

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

The doctor prescribes silicon - Healthcare in the 21st century

Living longer and healthier: persuasive wearable technology for prevention, cure and care

Sensor interfaces for IoE

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling

Silicon nitride based planar integrated circuits for biophotonics applications

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes

Barrier/liner stacks for scaling the Cu interconnect metallization

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

Multi-walled carbon nanotubes evaluated for nanointerconnect applications

Demonstration of upstream flexible 2-/4-PAM formats for practical PON deployments

Process window discovery methodology development for advanced lithography

Experimental analysis of the performance of Facade-integrated BIPV in deifferent configurations

Comparing ballistic Landauer quantum transport to time-evolved Wigner functions

Conference contributions: Recent submissions

Small pitch, high aspect ratio via-last TSV module ﻿

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module ﻿

The doctor prescribes silicon - Healthcare in the 21st century ﻿

Living longer and healthier: persuasive wearable technology for prevention, cure and care ﻿

Sensor interfaces for IoE ﻿

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator ﻿

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate ﻿

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser ﻿

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching ﻿

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs ﻿

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling ﻿

Silicon nitride based planar integrated circuits for biophotonics applications ﻿

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes ﻿

Barrier/liner stacks for scaling the Cu interconnect metallization ﻿

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects ﻿

Multi-walled carbon nanotubes evaluated for nanointerconnect applications ﻿

Demonstration of upstream flexible 2-/4-PAM formats for practical PON deployments ﻿

Process window discovery methodology development for advanced lithography ﻿

Experimental analysis of the performance of Facade-integrated BIPV in deifferent configurations ﻿

Comparing ballistic Landauer quantum transport to time-evolved Wigner functions ﻿

Small pitch, high aspect ratio via-last TSV module

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

The doctor prescribes silicon - Healthcare in the 21st century

Living longer and healthier: persuasive wearable technology for prevention, cure and care

Sensor interfaces for IoE

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling

Silicon nitride based planar integrated circuits for biophotonics applications

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes

Barrier/liner stacks for scaling the Cu interconnect metallization

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

Multi-walled carbon nanotubes evaluated for nanointerconnect applications

Demonstration of upstream flexible 2-/4-PAM formats for practical PON deployments

Process window discovery methodology development for advanced lithography

Experimental analysis of the performance of Facade-integrated BIPV in deifferent configurations

Comparing ballistic Landauer quantum transport to time-evolved Wigner functions