Recently added

Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures

Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Hangen, Ude; Baklanov, Mikhaïl (2016)

Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures

Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Baklanov, Mikhaïl (2016)

The development of an EUVL pellicle comprising carbon nanomaterials

Vanpaemel, Johannes; Lee, Jae Uk; Krishnaraj, Chidharth; Pollentier, Ivan; Huyghebaert, Cedric; Adelmann, Christoph; Gallagher, Emily (2016)

Design of a segmented modulator driver for advanced modulation formats

Vanhoecke, Michael; Aimone, Alessandro; Dris, Stefanos; Apostolopoulos, Dimitris; Bosman, Erwin; Van Steenberge, Geert; Torfs, Guy; Yin, Xin; Bauwelinck, Johan (2016)

Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers

Vanhoecke, M.; Argyris, N.; Aimone, A.; Dris, S.; Apostolopoulos, D.; Verhemeldonck, Koen; Vaernewyck, R.; Torfs, Guy; Yin, Xin; Bosman, Erwin; Fiol, G.; Gruner, M.; Klötzer, R.; Bauwelinck, Johan; Avramopoulos, H. (2016)

A biocompatible active artificial iris

Vanhaverbeke, Celine; Vasquez Quintero, Andres; De Smet, Jelle; De Smet, Herbert (2016)

A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

Vanfleteren, Jan; Bossuyt, Frederick; Plovie, Bart (2016)

Tunnel FETs for low power electronics

Vandooren, Anne; Alian, AliReza; Verhulst, Anne; Franco, Jacopo; Rooyackers, Rita; Smets, Quentin; Verreck, Devin; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2016)

Four-point bending cycling as alternative for thermal cycling solder fatigue testing

Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04)

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Vandevelde, Bart; Degrendele, Lieven; Cauwe, Maarten; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2016-04)

Distributed bayesian probabilistic matrix factorization

Vander Aa, Tom; Chakroun, Imen; Haber, Tom (2016)

How to use HPC Tools to do Machine Learning at Scale

Vander Aa, Tom; Ashby, Tom (2016)

Encrypted body-to-body wireless sensor node employing channel-state-based key generation

Van Torre, Patrick; Castel, Thijs; Rogier, Hendrik (2016-04)

New materials for multifunctional photonics ICs

Van Thourhout, Dries; Wang, Zhechao; Tian, Bin; Shi, Yuting; Pantouvaki, Marianna; Merckling, Clement; Hu, Yu; Asselberghs, Inge; Brems, Steven; Abdolahi, L.; Alessandri, Chiara; George, john; Beeckman, J.; Min-Hsiang, H.; Absil, Philippe; Van Campenhout, Joris (2016)

III-V on silicon DFB laser arrays

Van Thourhout, Dries; Shi, Yuting; Tian, Bin; Wang, Zhechao; Pantouvaki, Marianna; Merckling, Clement; Kunert, Bernardette; Guo, Weiming; Van Campenhout, Joris (2016)

III-V on silicon DFB laser arrays

Van Thourhout, Dries; Shi, Yuting; Tian, Bin; Wang, Zhechao; Pantouvaki, Marianna; Merckling, Clement; Kunert, Bernardette; Guo, Weiming; Van Campenhout, Joris (2016)

Mask 3D effect mitigation by source optimization and assist feature placement

Van Look, Lieve; Mochi, Iacopo; Philipsen, Vicky; Gallagher, Emily; Hendrickx, Eric; McIntyre, Greg; Wittebrood, Friso; Lyakhova, Kateryna; de Winter, Laurens; Last, Thorsten; Fliervoet, Timon; Schiffelers, Guido; Finders, Jo; Van Adrichem, Paul; Lyons, Adam; Laenens, Bart; Liddle, Jack; Neumann, Jens Timo (2016)

Conference contributions: Recent submissions

Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures

Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures

The development of an EUVL pellicle comprising carbon nanomaterials

Design of a segmented modulator driver for advanced modulation formats

Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers

A biocompatible active artificial iris

A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

Tunnel FETs for low power electronics

Four-point bending cycling as alternative for thermal cycling solder fatigue testing

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Distributed bayesian probabilistic matrix factorization

How to use HPC Tools to do Machine Learning at Scale

Encrypted body-to-body wireless sensor node employing channel-state-based key generation

New materials for multifunctional photonics ICs

III-V on silicon DFB laser arrays

III-V on silicon DFB laser arrays

Mask 3D effect mitigation by source optimization and assist feature placement

An integrated tunable electrical-balance filter with >60dB stopband attenuation and 1.75-3.7GHz stopband tuning range

Highly integrated front-end modules based on electrical-balance duplexers

100 Gb/s serial transmission over Copper using duo-binary signaling

Conference contributions: Recent submissions

Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures ﻿

Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures ﻿

The development of an EUVL pellicle comprising carbon nanomaterials ﻿

Design of a segmented modulator driver for advanced modulation formats ﻿

Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers ﻿

A biocompatible active artificial iris ﻿

A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits ﻿

Tunnel FETs for low power electronics ﻿

Four-point bending cycling as alternative for thermal cycling solder fatigue testing ﻿

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance ﻿

Distributed bayesian probabilistic matrix factorization ﻿

How to use HPC Tools to do Machine Learning at Scale ﻿

Encrypted body-to-body wireless sensor node employing channel-state-based key generation ﻿

New materials for multifunctional photonics ICs ﻿

III-V on silicon DFB laser arrays ﻿

III-V on silicon DFB laser arrays ﻿

Mask 3D effect mitigation by source optimization and assist feature placement ﻿

An integrated tunable electrical-balance filter with >60dB stopband attenuation and 1.75-3.7GHz stopband tuning range ﻿

Highly integrated front-end modules based on electrical-balance duplexers ﻿

100 Gb/s serial transmission over Copper using duo-binary signaling ﻿

Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures

Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures

The development of an EUVL pellicle comprising carbon nanomaterials

Design of a segmented modulator driver for advanced modulation formats

Multi-level optical signal generation using a segmented-electrode InP IQ-MZM with integrated CMOS binary drivers

A biocompatible active artificial iris

A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

Tunnel FETs for low power electronics

Four-point bending cycling as alternative for thermal cycling solder fatigue testing

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Distributed bayesian probabilistic matrix factorization

How to use HPC Tools to do Machine Learning at Scale

Encrypted body-to-body wireless sensor node employing channel-state-based key generation

New materials for multifunctional photonics ICs

III-V on silicon DFB laser arrays

III-V on silicon DFB laser arrays

Mask 3D effect mitigation by source optimization and assist feature placement

An integrated tunable electrical-balance filter with >60dB stopband attenuation and 1.75-3.7GHz stopband tuning range

Highly integrated front-end modules based on electrical-balance duplexers

100 Gb/s serial transmission over Copper using duo-binary signaling