Recently added

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

Wong, C.S.; Ivankovic, Andrej; Cowley, A.; Bennett, N.S.; Danilewsky, A.; Gonzalez, Mario; Cherman, Vladimir; Vandevelde, Bart; De Wolf, Ingrid; McNally, P.J. (2014)

10 GBd modulator directly driven by an FPGA without elctrical amplification

Wolf, S.; Schindler, P.C.; Ronniger, G.; Lauermann, M.; Palmer, R.; Koeber, S.; Korn, D.; Bogaerts, Wim; Leuthold, J.; Freude, W.; Koos, C. (2014)

DAC-less and amplifier-less generation and transmission of 16QAM signals using a sub-volt silicon photonic modulator

Wolf, S.; Lauermann, M.; Ronniger, G.; Schindler, P.C.; Palmer, R.; Koeber, S.; Bogaerts, Wim; Leuthold, J.; Freude, W.; Koos, C. (2014)

Modelling the lithography of ion implantation resists on topography

Winroth, Gustaf; Vaglio Pret, Alessandro; Ercken, Monique; Robertson, Stewart; Biafore, John J. (2014)

Automatic load-based MOSFET segmentation for switching DC-DC converters

Windels, Jindrich; Monte, Ann; De Pauw, Herbert; Doutreloigne, Jan (2014)

Tuning the strength of chemical patterns for directed self-assembly of block copolymers

Williamson, Lance; Lin, Guanyang; Cao, Yi; Gronheid, Roel; Nealey, Paul (2014)

A compact device for digital droplet PCR

Wiederkehr, Rodrigo Sergio; Jones, Ben; Majeed, Bivragh; Colle, Frederik; Wei-C, Chen; Stakenborg, Tim; Fiorini, Paolo; Lagae, Liesbet; Schimidt, Kristiane; Stuyver, Lieven (2014)

A silicon based Lab on a chip for digital droplet PCR

Wiederkehr, Rodrigo Sergio; Jones, Ben; Majeed, Bivragh; Colle, Frederik; Chen, Wei-Chiang; Stakenborg, Tim; Fiorini, Paolo; Lagae, Liesbet; Schimdt, Kristiane; Stuyver, Lieven (2014)

Improved performance of highly multiplexed silicon-on-insulator microring sensor chips by surface structure implementation

Werquin, Sam; Vermeulen, Diedrik; Goes, Arne; Van Eeghem, Anabelle; Dubruel, Peter; Bienstman, Peter (2014)

High Q photonic crystal cavities realised using deep ultraviolet lithography

Welna, Karl; Debnath, K.; Dumon, Pieter; Khanna, Amit; Krauss, T.F.; O'Faolain, Liam (2014)

Data transmission at terabit/s data using silicon-organic hybrid (SOH) frequency combs

Weimann, C.; Schindler, P.C.; Bekele, D.; Palmer, R.; Korn, D.; Pfeifle, J.; Koeber, S.; Schmogrow, R.; Alloatti, L.; Elder, D.L.; Hui, Yu; Bogaerts, Wim; Dalton, L.R.; Freude, W.; Leuthold, J.; Koos, C. (2014)

Non-Monte-Carlo methodology for high-sigma simulations of circuits under workload-dependent BTI degradation – application to 6T SRAM

Weckx, Pieter; Kaczer, Ben; Kukner, Halil; Roussel, Philippe; Raghavan, Praveen; Catthoor, Francky; Groeseneken, Guido (2014)

GeSn strain relaxation studies in view of SRB applications

Wang, Wei; Shimura, Yosuke; Vandervorst, Wilfried; Loo, Roger (2014)

Study of GeSn strain relaxation and thermal stability in view of strain relaxed buffer layer applications

Wang, Wei; Loo, Roger; Shimura, Yosuke; Vandervorst, Wilfried (2014-11)

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014)

Gas leak rate study of MEMS thin film package in different environments

Wang, Bo; De Coster, Jeroen; Wevers, Martine; De Wolf, Ingrid (2014)

An InGaAs/InP quantum well FinFET using the replacement fin process integrated in an RMG flow on 300mm Si substrates

Waldron, Niamh; Merckling, Clement; Guo, Weiming; Ong, Patrick; Teugels, Lieve; Ansar, Sheikh; Tsvetanova, Diana; Sebaai, Farid; van Dorp, Dennis; Milenin, Alexey; Lin, Dennis; Nyns, Laura; Mitard, Jerome; Pourghaderi, Mohammad Ali; Douhard, Bastien; Richard, Olivier; Bender, Hugo; Boccardi, Guillaume; Caymax, Matty; Heyns, Marc; Vandervorst, Wilfried; Barla, Kathy; Collaert, Nadine; Thean, Aaron (2014)

Conference contributions: Recent submissions

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

10 GBd modulator directly driven by an FPGA without elctrical amplification

DAC-less and amplifier-less generation and transmission of 16QAM signals using a sub-volt silicon photonic modulator

Modelling the lithography of ion implantation resists on topography

Automatic load-based MOSFET segmentation for switching DC-DC converters

Tuning the strength of chemical patterns for directed self-assembly of block copolymers

A compact device for digital droplet PCR

A silicon based Lab on a chip for digital droplet PCR

Improved performance of highly multiplexed silicon-on-insulator microring sensor chips by surface structure implementation

High Q photonic crystal cavities realised using deep ultraviolet lithography

Data transmission at terabit/s data using silicon-organic hybrid (SOH) frequency combs

Non-Monte-Carlo methodology for high-sigma simulations of circuits under workload-dependent BTI degradation – application to 6T SRAM

GeSn strain relaxation studies in view of SRB applications

Study of GeSn strain relaxation and thermal stability in view of strain relaxed buffer layer applications

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Gas leak rate study of MEMS thin film package in different environments

An InGaAs/InP quantum well FinFET using the replacement fin process integrated in an RMG flow on 300mm Si substrates

Root-cause failure analysis reveals harmful interaction between non-adjacent MoO3 and Al layers

OPV stability: Designed to last

Active dipole coupling in an array environment

Conference contributions: Recent submissions

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips ﻿

10 GBd modulator directly driven by an FPGA without elctrical amplification ﻿

DAC-less and amplifier-less generation and transmission of 16QAM signals using a sub-volt silicon photonic modulator ﻿

Modelling the lithography of ion implantation resists on topography ﻿

Automatic load-based MOSFET segmentation for switching DC-DC converters ﻿

Tuning the strength of chemical patterns for directed self-assembly of block copolymers ﻿

A compact device for digital droplet PCR ﻿

A silicon based Lab on a chip for digital droplet PCR ﻿

Improved performance of highly multiplexed silicon-on-insulator microring sensor chips by surface structure implementation ﻿

High Q photonic crystal cavities realised using deep ultraviolet lithography ﻿

Data transmission at terabit/s data using silicon-organic hybrid (SOH) frequency combs ﻿

Non-Monte-Carlo methodology for high-sigma simulations of circuits under workload-dependent BTI degradation – application to 6T SRAM ﻿

GeSn strain relaxation studies in view of SRB applications ﻿

Study of GeSn strain relaxation and thermal stability in view of strain relaxed buffer layer applications ﻿

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs ﻿

Gas leak rate study of MEMS thin film package in different environments ﻿

An InGaAs/InP quantum well FinFET using the replacement fin process integrated in an RMG flow on 300mm Si substrates ﻿

Root-cause failure analysis reveals harmful interaction between non-adjacent MoO3 and Al layers ﻿

OPV stability: Designed to last ﻿

Active dipole coupling in an array environment ﻿

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

10 GBd modulator directly driven by an FPGA without elctrical amplification

DAC-less and amplifier-less generation and transmission of 16QAM signals using a sub-volt silicon photonic modulator

Modelling the lithography of ion implantation resists on topography

Automatic load-based MOSFET segmentation for switching DC-DC converters

Tuning the strength of chemical patterns for directed self-assembly of block copolymers

A compact device for digital droplet PCR

A silicon based Lab on a chip for digital droplet PCR

Improved performance of highly multiplexed silicon-on-insulator microring sensor chips by surface structure implementation

High Q photonic crystal cavities realised using deep ultraviolet lithography

Data transmission at terabit/s data using silicon-organic hybrid (SOH) frequency combs

Non-Monte-Carlo methodology for high-sigma simulations of circuits under workload-dependent BTI degradation – application to 6T SRAM

GeSn strain relaxation studies in view of SRB applications

Study of GeSn strain relaxation and thermal stability in view of strain relaxed buffer layer applications

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Gas leak rate study of MEMS thin film package in different environments

An InGaAs/InP quantum well FinFET using the replacement fin process integrated in an RMG flow on 300mm Si substrates

Root-cause failure analysis reveals harmful interaction between non-adjacent MoO3 and Al layers

OPV stability: Designed to last

Active dipole coupling in an array environment