Recently added

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

Pham, Nga; Soussan, Philippe; Peng, Lan; Rosmeulen, Maarten; Sabuncuoglu Tezcan, Deniz (2014)

A reliability lab-on-chip using programmable arrays

Pfeifer, P.; Kaczer, Ben; Pliva, Z. (2014)

Enhancement of raman scattering efficiency by on-chip nanoplasmonic antennas

Peyskens, Frederic; Subramanian, Ananth; Neutens, P.; Dhakal, Ashim; Wuytens, Pieter; Van Dorpe, P.; Le Thomas, Nicolas; Baets, Roel (2014)

Integration of heat-transfer resistance measurements onto a digital microfluidic platform towards the miniaturized and automated label-free detection of biomolecular interactions

Pérez-Ruiz, E.; Vandenryt, Thijs; Witters, D.; Decrop, D.; Van Grinsven, Bart; Spasic, D.; Wagner, Patrick; Lammertyn, J. (2014)

W2W permanent stacking for 3D system integration

Peng, Lan; Kim, Soon-Wook; Soules, Michael; Gabriel, Markus; Zoberbier, Margarete; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric (2014)

Defect capture sensitivity in 14 nm half-pitch line/space DSA patterns

Pathangi Sriraman, Hari; Gronheid, Roel; Van Den Heuvel, Dieter; Rincon Delgadillo, Paulina; Chan, BT; Van Look, Lieve; Bayana, Hareen; Cao, Yi; Her, YoungJun; Lin, Guanyang; Parnell, Doni; Nafus, Kathleen; Somervell, Mark; Harukawa, Ryoto; Chikashi, Ito; Nagaswami, Venkat; D'Urzo, Lucia; Nealey, Paul (2014)

A fast 4-channel silicon switch using an AWG with 12 carrier depletion modulators

Pathak, S.; Yu, H.; Van Thourhout, Dries; Bogaerts, Wim (2014)

8x14Gb/s Si ring WDM modulator array with integrated tungsten heaters and Ge monitor photodetectors

Pantouvaki, Marianna; Verheyen, Peter; Lepage, Guy; De Coster, Jeroen; Hui, Yu; De Heyn, Peter; Masood, Adil; Bogaerts, Wim; Absil, Philippe; Van Campenhout, Joris (2014)

Computationally-efficient compressive sampling for low-power pulseoximeter system

Pamula, Venkata Rajesh; Verhelst, Marian; Yazicioglu, Refet Firat; Van Hoof, Chris (2014)

Progress in silicon-organic hybrid (SOH) integration

Palmer, R.; Koeber, S.; Woessner, M.; Heni, W.; Elder, D.L.; Korn, D.; Weimann, C.; Schindler, P.C.; Bekele, D.; Alloatti, L.; Bogaerts, Wim; Dalton, L.R.; Leuthold, J.; Freude, W.; Koos, C. (2014)

High-speed silicon-organic hybrid (SOH) modulators with 230 pm/V electro-optic coefficient using advanced materials

Palmer, R.; Koeber, S.; Woessner, M.; Elder, D.L.; Heni, W.; Yu, H.; Lauermann, M.; Bogaerts, Wim; Dalton, L.R.; Freude, W.; Leuthold, J.; Koos, C. (2014)

Progress on nanopatterned front electrodes for organic solar cells

Paetzold, Ulrich W.; Smeets, Michael; Hadipour, Afshin; Cheyns, David (2014)

Focus spot reduction by brush scrubber cleaning

Pacco, Antoine; Kesters, Els; Simms, Ihsan; Nafus, Kathleen; Vandereyken, Jelle; Yonekawa, Hiroki (2014)

Mid-IR nonlinear integrated photonics: physics and devices

Osgood Jr., R.M.; Liu, X.; Lavdas, S.; Dadap, J.; Souhan, B.; Driscoll, J.; Grote, R.; Kuyken, Bart; Roelkens, Gunther; Panoiu, N.C.; Baets, Roel; Green, W.M.J. (2014)

Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling

Oprins, Herman; Beyne, Eric (2014-05)

Conference contributions: Recent submissions

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

A reliability lab-on-chip using programmable arrays

Enhancement of raman scattering efficiency by on-chip nanoplasmonic antennas

Integration of heat-transfer resistance measurements onto a digital microfluidic platform towards the miniaturized and automated label-free detection of biomolecular interactions

W2W permanent stacking for 3D system integration

Defect capture sensitivity in 14 nm half-pitch line/space DSA patterns

A fast 4-channel silicon switch using an AWG with 12 carrier depletion modulators

8x14Gb/s Si ring WDM modulator array with integrated tungsten heaters and Ge monitor photodetectors

Computationally-efficient compressive sampling for low-power pulseoximeter system

Progress in silicon-organic hybrid (SOH) integration

High-speed silicon-organic hybrid (SOH) modulators with 230 pm/V electro-optic coefficient using advanced materials

Progress on nanopatterned front electrodes for organic solar cells

Focus spot reduction by brush scrubber cleaning

Mid-IR nonlinear integrated photonics: physics and devices

Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling

Biocompatible polymers as bi-directional diffusion barriers for hermetic encapsulation of implantable electronics

CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries

CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries

Fin width influence on analog performance of SOI and bulk FinFETs

A bottom-up cell modeling strategy using broadband microwave and millimeter wave dielectric spectroscopy

Conference contributions: Recent submissions

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process ﻿

A reliability lab-on-chip using programmable arrays ﻿

Enhancement of raman scattering efficiency by on-chip nanoplasmonic antennas ﻿

Integration of heat-transfer resistance measurements onto a digital microfluidic platform towards the miniaturized and automated label-free detection of biomolecular interactions ﻿

W2W permanent stacking for 3D system integration ﻿

Defect capture sensitivity in 14 nm half-pitch line/space DSA patterns ﻿

A fast 4-channel silicon switch using an AWG with 12 carrier depletion modulators ﻿

8x14Gb/s Si ring WDM modulator array with integrated tungsten heaters and Ge monitor photodetectors ﻿

Computationally-efficient compressive sampling for low-power pulseoximeter system ﻿

Progress in silicon-organic hybrid (SOH) integration ﻿

High-speed silicon-organic hybrid (SOH) modulators with 230 pm/V electro-optic coefficient using advanced materials ﻿

Progress on nanopatterned front electrodes for organic solar cells ﻿

Focus spot reduction by brush scrubber cleaning ﻿

Mid-IR nonlinear integrated photonics: physics and devices ﻿

Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling ﻿

Biocompatible polymers as bi-directional diffusion barriers for hermetic encapsulation of implantable electronics ﻿

CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries ﻿

CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries ﻿

Fin width influence on analog performance of SOI and bulk FinFETs ﻿

A bottom-up cell modeling strategy using broadband microwave and millimeter wave dielectric spectroscopy ﻿

Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

A reliability lab-on-chip using programmable arrays

Enhancement of raman scattering efficiency by on-chip nanoplasmonic antennas

Integration of heat-transfer resistance measurements onto a digital microfluidic platform towards the miniaturized and automated label-free detection of biomolecular interactions

W2W permanent stacking for 3D system integration

Defect capture sensitivity in 14 nm half-pitch line/space DSA patterns

A fast 4-channel silicon switch using an AWG with 12 carrier depletion modulators

8x14Gb/s Si ring WDM modulator array with integrated tungsten heaters and Ge monitor photodetectors

Computationally-efficient compressive sampling for low-power pulseoximeter system

Progress in silicon-organic hybrid (SOH) integration

High-speed silicon-organic hybrid (SOH) modulators with 230 pm/V electro-optic coefficient using advanced materials

Progress on nanopatterned front electrodes for organic solar cells

Focus spot reduction by brush scrubber cleaning

Mid-IR nonlinear integrated photonics: physics and devices

Generic thermal modeling study of the impact of 3D-interposer material and thickness options on the thermal performance and die-to-die thermal coupling

Biocompatible polymers as bi-directional diffusion barriers for hermetic encapsulation of implantable electronics

CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries

CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries

Fin width influence on analog performance of SOI and bulk FinFETs

A bottom-up cell modeling strategy using broadband microwave and millimeter wave dielectric spectroscopy