Publication:
Cu interconnect lifetime estimation in the presence of thermal gradients
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Acq. date: 2026-08-23
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65 since deposited on 2025-03-04
19last month
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Acq. date: 2026-08-23
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203 since deposited on 2025-03-04
1last month
Acq. date: 2026-08-23
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