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Cu interconnect lifetime estimation in the presence of thermal gradients
Publication:
Cu interconnect lifetime estimation in the presence of thermal gradients
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Date
2025-FEB 21
Journal article
https://doi.org/10.1063/5.0245489
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ding, Y.
;
Pedreira, O. Varela
;
Lofrano, M.
;
Zahedmanesh, H.
;
Ciofi, I.
;
Chavez, T.
;
Farr, H.
;
De Wolf, I.
;
Croes, K.
Journal
JOURNAL OF APPLIED PHYSICS
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188
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Acq. date: 2026-01-10
Citations
Metrics
Views
188
since deposited on 2025-03-04
3
last month
1
last week
Acq. date: 2026-01-10
Citations