Publication:

Cu interconnect lifetime estimation in the presence of thermal gradients

Date

2025
Journal article
https://doi.org/10.1063/5.0245489
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Author(s)

Ding, Youqi  
;
Varela Pedreira, Olalla  
;
Lofrano, Melina  
;
Zahedmanesh, Houman  
;
Ciofi, Ivan  
;
Chavez, T.
;
Farr, H.
;
De Wolf, Ingrid  
;
Croes, Kristof  

Journal

JOURNAL OF APPLIED PHYSICS

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