Browsing Articles by author "Labie, Riet"
Now showing items 1-20 of 20
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18% efficiency IBC cell with rear-surface processed on quartz
Dross, Frederic; O'Sullivan, Barry; Debucquoy, Maarten; Bearda, Twan; Govaerts, Jonathan; Labie, Riet; Loozen, Xavier; Granata, Stefano; El Daif, Ounsi; Trompoukis, Christos; Van Nieuwenhuysen, Kris; Meuris, Marc; Gordon, Ivan; Posthuma, Niels; Baert, Kris; Poortmans, Jef; Boulord, Caroline; Beaucarne, Guy (2013) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Cost-effective and reliable Ni/Cu plating for p- and n-type PERx silicon solar cells
Russell, Richard; Tous, Loic; Labie, Riet; Aleman, Monica; Duerinckx, Filip; Bertens, Jurgen; Horiuchi, Takeshi; Szlufcik, Jozef (2013) -
Crystalline thin-foil silicon solar cells: where crystalline quality meets thin-film processing
Dross, Frederic; Baert, Kris; Bearda, Twan; Deckers, Jan; Depauw, Valerie; El Daif, Ounsi; Gordon, Ivan; Gougam, Adel; Govaerts, Jonathan; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; Masolin, Alex; O'Sullivan, Barry; Qiu, Yu; Vaes, Jan; Van Gestel, Dries; Van Hoeymissen, Jan; Vanleenhove, Anja; Van Nieuwenhuysen, Kris; Venkatachalam, Srisaran; Meuris, Marc; Poortmans, Jef (2012) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Detailed structural and electrical characterization of plated crystalline silicon solar cells
Dang Thi Thuy, Chi; Labie, Riet; Simoen, Eddy; Poortmans, Jef (2018-05) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Flip-Chip Montage statt Draht-Bonden
Labie, Riet; Beyne, Eric; Van Hoof, Rita; Honoré, Mia; Beerten, Steven (2000) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2011) -
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Okoro, Chukwudi; Vanstreels, Kris; Labie, Riet; Luhn, Ole; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2010) -
Influence of intermetallic properties of lead-free flip chip solder joints
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Vandepitte, Dirk; Verlinden, Bert (2008) -
Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
Salenbien, R.; Cote, R.; Goossens, J.; Limaye, Paresh; Labie, Riet; Glorieux, C. (2011) -
Molecular detection of SARS-COV-2 in exhaled breath at the point-of-need
Stakenborg, Tim; Raymenants, Joren; Taher, Ahmed; Marchal, Elisabeth; Verbruggen, Bert; Roth, Sophie; Jones, Ben; Yurt, Abdulkadir; Duthoo, Wout; Bombeke, Klaas; Fauvart, Maarten; Verplanken, Julien; Wiederkehr, Rodrigo Sergio; Humbert, Aurelie; Dang Thi Thuy, Chi; Vlassaks, Evi; Jauregui Uribe, Alejandra; Luo, Zhenxiang; Liu, Chengxun; Zinoviev, Kirill; Labie, Riet; Darriba Frederiks, Aduen; Saldien, Jelle; Covens, Kris; Berden, Pieter; Schreurs, Bert; Van Duppen, Joost; Hanifa, Rabea; Beuscart, Megane; Pham, Van; Emmen, Erik; Dewagtere, Annelien; Lin, Ziduo; Peca, Marco; El Jerrari, Youssef; Nawghane, Chinmay; Arnett, Chad; Lambrechts, Andy; Deshpande, Paru; Lagrou, Katrien; De Munter, Paul; Andre, Emmanuel; Van den Wijngaert, Nik; Peumans, Peter (2022) -
Packaging research goes lead-free: a microscopic look on reliability issues
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-10) -
Process-induced degradation of SiO2 and a-Si:H passivation layers for photovoltaic applications
O'Sullivan, Barry; Bearda, Twan; Nadupalli, Shankari; Labie, Riet; Baert, Kris; Gordon, Ivan; Poortmans, Jef (2014) -
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
Yang, Yu; Labie, Riet; Ling, Fangzhou; Zhao, Chao; Radisic, Alex; Van Olmen, Jan; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid (2010) -
Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
Labie, Riet; Ruythooren, Wouter; Van Humbeeck, Jan (2007) -
The impact of back-side Cu contamination on 3D stacking architecture
Yang, Yu; Labie, Riet; Richard, Olivier; Bender, Hugo; Zhao, Chao; Verlinden, Bert; De Wolf, Ingrid (2010)