Browsing Presentations by author "Gao, Teng"
Now showing items 1-6 of 6
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Integration HSQ into direct-on-metal approach for 0.25µm technology
Gao, Teng; Witvrouw, Ann; Coenegrachts, Bart; Bruynseraede, Christophe; Van Hove, Marleen; Maex, Karen (1999) -
Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process
Gao, Teng; Gray, William; Van Hove, Marleen; Struyf, Herbert; Meynen, Herman; Vanhaelemeersch, Serge (1999) -
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998) -
Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Gray, William; Loboda, M.; Struyf, Herbert; Van Hove, Marleen; Donaton, R. A.; Sleeckx, Erik; Stucchi, Michele; Gao, Teng; Boullart, Werner; Coenegrachts, Bart; Maenhoudt, Mireille; Vanhaelemeersch, Serge; Meynen, Herman; Maex, Karen (2000) -
The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process
Meynen, Herman; Waeterloos, Joost; Coenegrachts, Bart; Gao, Teng; Grillaert, Joost; Van den hove, Luc (1996) -
The integration of low k hydrogen silsesquioxanes (HSQ) in sub 0.35µm processes
Meynan, H.; Uttech, R.; Gao, Teng; Van Hove, Marleen; Maex, Karen (1998)