Browsing by Author "Arnold, Kim"
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Publication Advances in temporary carrier technology for high density fan-out device build-up
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.340-345Publication Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Meeting abstract2017, IEEE 67th Electronic Components and Technology Conference - ECTC, 30/05/2017, p.740-745Publication Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
; ; ; ; ; Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.1685-1690Publication Single-release-layer process for temporary bonding applications in 3D integration area
Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.896-898Publication Temporary bonding for high-topography applications: spin-on material versus dry film
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898Publication The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Proceedings paper2019, 2019 International Wafer Level Packaging Conference (IWLPC), 13/10/2019Publication Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898