Browsing by Author "Brunion, Moritz"
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Publication 3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs
Proceedings paper2024, IEEE International Symposium on Circuits and Systems (ISCAS), MAY 19-22, 2024Publication Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC
Journal article2025, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (33) 2, p.346-357Publication Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Proceedings paper2023, IEEE International 3D Systems Integration Conference (3DIC), MAY 10-12, 2023Publication Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs
Journal article2024, IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, (43) 7, p.1957-1970Publication Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC
Journal article2023, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (31) 12, p.1896-1904Publication MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration
Publication Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
Proceedings paper2021, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), JUL 26-28, 2021Publication Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs
Journal article2023, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, (13) 3, p.300-314Publication System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory
Journal article2024, IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 10, p.125-134Publication Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies
Proceedings paper2024, International Reliability Physics Symposium (IRPS), APR 14-18, 2024Publication Thermal Performance Analysis of Mempool RISC-V Multicore SoC
Journal article2022, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (30) 11, p.1668-1676Publication Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)
Proceedings paper2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023