Browsing by Author "Buisson, Thibault"
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Publication 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Meeting abstract2010-11, IEEE International 3D System Integration Conference - 3DIC, 16/11/2010Publication 3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Proceedings paper2012, IEEE International Conference on IC Design and technology - ICICDT, 30/05/2012Publication 3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication 3D stacking using ultra thin dies
Proceedings paper2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.3-MarPublication An IC-centric biocompatible chip encapsulation fabrication process
Proceedings paper2010, Electronics System Integratio Technology Conference - ESTC, 13/09/2010Publication Analysis of microbump induced stress effects in 3D stacked IC technologies
; ; Proceedings paper2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.9-AprPublication Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
Proceedings paper2012-06, 62nd Electronic Components and Technology Conference - ECTC, 29/05/2012, p.532-536Publication Development of integrated wet cleans for 3D-SIC technologies
Proceedings paper2013, Ultra Clean Processing of Semiconductor Surfaces XI - UCPSS, 17/09/2012, p.150-153Publication Dry etch solutions for 3D integration technology
Meeting abstract2010, 3rd Plasma Etch and Strip in Microelectronics Workshop - PESM, 4/03/2010Publication Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Proceedings paper2011, 13th Electronics Packaging Technology Conference - EPTC, 7/12/2011Publication Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
Proceedings paper2011, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.1122-1125Publication Key elements for sub-50μm pitch micro bump processes
Proceedings paper2013, 63rd Electronic Components and Technology Conference - ECTC, 28/05/2013, p.1122-1126Publication Ultra thin chip embedding technology (UTCS-UTCP)
; ; ; Iker, FrancoisOral presentation2010, Embedded Wafer level Packaging Workshop, IMAPS-FrancePublication Ultra thin die embedding technology with 20um-pitch interconnection
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.1575-1580Publication Wafer thinning and back side processing to enable 3D stacking
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012