Browsing by Author "Chandrasekhar, Arun"
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Publication Accurate Extraction of Time Domain Performance through Windowless Transforms
Oral presentation2003, IMAPS Advanced Technology Workshop - ATWPublication Accurate RF electrical characterisation of CSPs using MCM-D thin film technology
Proceedings paper2002, Proceedings 52nd Electronic Components and Technology Conference, 28/05/2002, p.70-78Publication Accurate RF electrical characterisation of CSPs using MCM-D thin film technology
Journal article2004, IEEE Trans. Advanced Packaging, (27) 1, p.203-212Publication Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
Chandrasekhar, ArunPHD thesis2004-10Publication Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Proceedings paper2001, Proceedings of the SMTA Conference; 30 Sept. - 4 October 2001; Chicago, IL, USA., p.431-468Publication Characterisation of IC packages for RF applications
Proceedings paper2001, Proceedings 9th URSI Forum; Cecember 2001; Louvain-la-Neuve, Belgium., p.4Publication Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
Proceedings paper2003, Proceedings 33rd European Microwave Conference, 7/10/2003, p.301-304Publication Comparison of the RF electrical performance of the PSGA and the BGA package
Proceedings paper2001, Proceedings 38th IMAPS Nordic Annual Conference; 23-26 Sept. 2001; Oslo, Norway., p.28-34Publication Distributed circuit models for near-CSP interconnects
Oral presentation2002, 11th Topical Meeting on the Electrical Performance of Electronic Packaging - EPEPPublication Electrical characterisation of the BGA package for RF applications
Proceedings paper2002, Proceedings MicroTech, 29/01/2002Publication Electrical characterisation of the BGA package for RF applications
Journal article2002, Microelectronics International, (19) 2, p.13-18Publication Factors involved in performance optimisation of GHz chip-package co-design
Proceedings paper2004-11, Proceedings 37th IMAPS International Symposium on Microelectronics, 14/11/2004Publication Foundations for successful RF chip-package co-design: a packaging perspective
Oral presentation2002, 10th URSI ForumPublication Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Journal article2003, IEEE Trans. Electronics Packaging Manufacturing, (26) 1, p.54-67Publication Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Proceedings paper2001, Proceedings 51st Electronic Components and Technology Conference - ECTC, 29/05/2001, p.141-148Publication Polymer Stud Grid Array, a lead-free and economic CSP
Journal article2001, On Board Technology, November, p.56-60Publication Reliability assessment for the Polymer Stud Grid Array (PSGA) package
Oral presentation2000, 37th IMAPS Nordic ConferencePublication RF evaluation of low-cost leadless packages and devlopment of distributed electrical models
Proceedings paper2003, Proceedings of the 53rd Electronic Components and Technology Conference, 27/05/2003, p.1550-1558Publication Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
Publication The influence of packaging materials on RF performance
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.221-226